SCHEMBL7537129

SCHEMBL7537129

CC(C)OC(=O)OC=Cc1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 2/20 0.45
CYP2C9 P11712 2/20 0.45
PDCD1 Q15116 1/20 0.45
CD274 Q9NZQ7 1/20 0.45
HPGD P15428 1/20 0.45
TDP1 Q9NUW8 2/20 0.43
GLA P06280 1/20 0.43
CA12 O43570 2/20 0.42
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
CA7 P43166 2/20 0.42
CA9 Q16790 2/20 0.42
CA14 Q9ULX7 2/20 0.42
AKR1B10 O60218 1/20 0.42
AKR1B1 P15121 1/20 0.42
TSHR P16473 1/20 0.42
ALDH1A1 P00352 2/20 0.41
LMNA P02545 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
HDAC3 O15379 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7542602 0.84 ALDH1A1 (0.49) CYP1A2CYP2C9TDP1GLAALDH1A1
SCHEMBL377478 0.83 HDAC1 (0.52) CYP1A2CYP2C9TDP1GLAALDH1A1
SCHEMBL2908043 0.82 TSHR (0.44) CYP1A2CYP2C9PDCD1CD274HPGD
SCHEMBL7538145 0.79 ALDH1A1 (0.47) CYP1A2CYP2C9HPGDTDP1GLA
SCHEMBL14504434 0.79 TDP1 (0.46) CYP1A2CYP2C9TDP1GLAALDH1A1
SCHEMBL27665248 0.79 TDP1 (0.46) CYP1A2CYP2C9TDP1GLAALDH1A1
SCHEMBL27783809 0.77 TDP1 (0.44) CYP1A2CYP2C9TDP1GLAALDH1A1
SCHEMBL7541866 0.76 MEN1 (0.53) HPGDTDP1GLAALDH1A1LMNA
SCHEMBL10913657 0.76 CYP2C19 (0.45) CYP1A2CYP2C9TDP1GLATSHR
SCHEMBL104809 0.76 CYP2C19 (0.45) CYP1A2CYP2C9TDP1GLATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1097073-C Polymer composition and resist meterial WAKO PURE CHEM IND LTD (JP) 2002-12-25 CN disclosed
US-20020015906-A1 Polymer for photoresist, method of production thereof and photoresist composition containing polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-02-07 US disclosed
CN-1159459-A Polymer composition and resist meterial WAKO PURE CHEM IND LTD (JP) 1997-09-17 CN disclosed
EP-0264908-A2 High sensitivity resists having autodecomposition temperatures greater than about 160 C International Business Machines Corporation (US) 1988-04-27 EP disclosed