SCHEMBL7540808

SCHEMBL7540808

O=C1C=C(N(C2=CC(=O)NC2=O)c2ccccc2Cc2ccccc2N(C2=CC(=O)NC2=O)C2=CC(=O)NC2=O)C(=O)N1

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
AR P10275 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10719678 0.84
SCHEMBL3346448 0.78 CXCR2 (0.34)
SCHEMBL2211488 0.73 POLB (0.41)
SCHEMBL11260189 0.69 ALDH1A1 (0.36)
SCHEMBL1133787 0.67 GSK3B (0.34)
SCHEMBL1458422 0.67 GSK3B (0.40)
SCHEMBL9491075 0.66 USP2 (0.34)
SCHEMBL11062027 0.64 ALDH1A1 (0.39) AR
SCHEMBL10472943 0.63 KDM4E (0.34)
SCHEMBL11342834 0.63 CES1 (0.49)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0861281-B1 Thermosetting bismaleimide polymer for composite and adhesive applications CYTEC TECH CORP (US) 2002-06-05 EP claimed
EP-0861280-B1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS CYTEC TECH CORP (US) 2001-12-12 EP claimed
EP-0001666-A2 Imide-crosslinked ethylenic polymer resin foams and method of making THE DOW CHEMICAL COMPANY (US) 1979-05-02 EP claimed
EP-0861281-B1 Thermosetting bismaleimide polymer for composite and adhesive applications CYTEC TECH CORP (US) 2002-06-05 EP disclosed
US-6313248-B1 CURABLE SOLID AROMATIC DIAMINE BISMALEIMIDE AND LIQUID ALKENYLPHENYL RESINS; DECREASED WEIGHT LOSS UPON AGING CYTEC TECHNOLOGY CORP. 2001-11-06 US disclosed