SCHEMBL754434

SCHEMBL754434

CC[CH][Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2361683 0.77 TSHR (0.30)
SCHEMBL643289 0.75
SCHEMBL373286 0.73
SCHEMBL15194455 0.73
SCHEMBL2361502 0.73
SCHEMBL2362149 0.73 TSHR (0.36)
SCHEMBL99530 0.71
SCHEMBL2361315 0.71 TSHR (0.37)
SCHEMBL3343488 0.71
SCHEMBL3343486 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 223 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4077429-A1 MOISTURE CURABLE POLYACRYLATE COMPOSITIONS AND USES THEREOF Henkel AG & Co. KGaA (DE) 2022-10-26 EP claimed
CN-114761110-A Composite semipermeable membrane 日东电工株式会社 2022-07-15 CN claimed
CN-114144442-A Moisture curable polyacrylate compositions and uses thereof 汉高知识产权控股有限责任公司 2022-03-04 CN claimed
WO-2021126988-A1 MOISTURE CURABLE POLYACRYLATE COMPOSITIONS AND USES THEREOF Henkel IP & Holding GmbH (DE) 2021-06-24 WO claimed
WO-2021117631-A1 COMPOSITE SEMI-PERMEABLE MEMBRANE 日東電工株式会社 2021-06-17 WO claimed
CN-110941142-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-05-25 CN claimed
EP-2435502-B1 CURABLE SILYL-GROUP CONTAINING COMPOSITIONS AND ITS USE EVONIK DEGUSSA GMBH (DE) 2016-10-19 EP claimed
US-8974627-B2 Curable compositions containing silyl groups, and use thereof EVONIK DEGUSSA GMBH (DE) 2015-03-10 US claimed
CN-102134254-B Silicon-containing benzoxazine resin as well as preparation method and application thereof UNIV SHANDONG 2014-04-02 CN claimed
US-20120067520-A1 Curable Compositions Containing Silyl Groups, And Use Thereof EVONIK GOLDSCHMIDT GMBH (DE) 2012-03-22 US claimed
EP-2231740-B1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2011-08-24 EP claimed
US-6706260-B1 COMPRISED OF POLYMER HAVING SUCH AS 2-METHACRYLOYLOXYETHYL PHOSPHORYLCHOLINE UNITS; CLEANING AND NECROTIC TISSUE REMOVAL; NONIRRITATING; ACCELERATING REEPITHELIALIZATION AND GRANULATION NOF CORPORATION (JP) 2004-03-16 US claimed
EP-1095665-A1 WOUND-COVERING PREPARATION, WOUND-COVERING MATERIAL, AND METHOD OF WOUND HEALING NOF CORPORATION (JP) 2001-05-02 EP claimed
EP-0632099-B1 Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICONE (JP) 1997-11-12 EP claimed
EP-0639606-B1 Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICONE (JP) 1997-05-21 EP claimed
US-5468827-A Epoxy-functional MQ organopolysiloxanes DOW CORNING TORAY SILICON CO., LTD. (JP) 1995-11-21 US claimed
US-5422412-A Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICON CO., LTD (JP) 1995-06-06 US claimed
EP-0639606-A1 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-02-22 EP claimed
EP-0632099-A2 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-01-04 EP claimed
JP-6016922-A None JP disclosed
JP-5295247-A None JP disclosed
JP-6065494-A None JP disclosed
JP-6107941-A None JP disclosed
JP-5194679-A None JP disclosed
JP-9124922-A None JP disclosed
US-12018123-B2 Diterminally amine-modified perfluoropolyether compound and preparation thereof, and liquid-repelling composition, cured product and coated substrate containing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-25 US disclosed
CN-118176598-A Composition for forming electrode mixture layer for lithium-sulfur secondary battery, electrode for lithium-sulfur secondary battery, and lithium-sulfur secondary battery 东亚合成株式会社 2024-06-11 CN disclosed
WO-2024106213-A1 METHOD FOR PRODUCING DISILOXANE COMPOUND 信越化学工業株式会社 2024-05-23 WO disclosed
WO-2024071051-A1 CURABLE COMPOSITION 株式会社カネカ 2024-04-04 WO disclosed
EP-4006042-B1 METHOD FOR PRODUCING NITROGEN-CONTAINING ORGANOXYSILANE COMPOUND SHINETSU CHEMICAL CO (JP) 2024-01-31 EP disclosed
WO-2024014350-A1 TWO-COMPONENT TYPE ROOM TEMPERATURE RAPID-CURABLE RESIN COMPOSITION AND ARTICLE 信越化学工業株式会社 2024-01-18 WO disclosed
CN-117396238-A Medical treatment material and method for producing same 东亚合成株式会社 2024-01-12 CN disclosed
WO-2023248850-A1 VINYL-BASED POLYMER, MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION 東亞合成株式会社 2023-12-28 WO disclosed
US-20230302413-A1 COMPOSITE SEMIPERMEABLE MEMBRANE AND SPIRAL MEMBRANE ELEMENT NITTO DENKO CORPORATION (JP) 2023-09-28 US disclosed
EP-4249106-A1 COMPOSITE SEMIPERMEABLE MEMBRANE AND SPIRAL MEMBRANE ELEMENT Nitto Denko Corporation (JP) 2023-09-27 EP disclosed
CN-116803478-A Composite semipermeable membrane and spiral membrane element 日东电工株式会社 2023-09-26 CN disclosed
US-11739184-B2 Polysiloxazane compound having alkoxysilyl group, process for producing same, and composition and cured product including same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-29 US disclosed
US-11733609-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-08-22 US disclosed
WO-2023127675-A1 ROOM-TEMPERATURE-CURING RESIN COMPOSITION AND ARTICLE 信越化学工業株式会社 2023-07-06 WO disclosed
WO-2023090398-A1 COMPOSITION FOR FORMING ELECTRODE BINDER LAYER FOR USE IN LITHIUM-SULFUR SECONDARY BATTERY, ELECTRODE FOR LITHIUM-SULFUR SECONDARY BATTERY, AND LITHIUM-SULFUR SECONDARY BATTERY 東亞合成株式会社 2023-05-25 WO disclosed
WO-2023090399-A1 COMPOSITION FOR FORMING ELECTRODE BINDER LAYER FOR USE IN LITHIUM-SULFUR SECONDARY BATTERY, ELECTRODE FOR LITHIUM-SULFUR SECONDARY BATTERY, AND LITHIUM-SULFUR SECONDARY BATTERY 東亞合成株式会社 2023-05-25 WO disclosed
US-11643576-B2 Pressure-sensitive adhesive composition and producing method thereof TOAGOSEI CO. LTD. (JP) 2023-05-09 US disclosed
WO-2023054700-A1 CURABLE COMPOSITION 株式会社カネカ 2023-04-06 WO disclosed
WO-2023053886-A1 METHOD FOR PRODUCING CYCLIC SILAZANE COMPOUND 信越化学工業株式会社 2023-04-06 WO disclosed
WO-2023054701-A1 CURABLE COMPOSITION 株式会社カネカ 2023-04-06 WO disclosed
WO-2023013594-A1 ELECTRODE BINDER, ELECTRODE MIXTURE LAYER FORMATION COMPOSITION, LITHIUM ION SECONDARY BATTERY ELECTRODE, AND LITHIUM ION SECONDARY BATTERY 東亞合成株式会社 2023-02-09 WO disclosed
WO-2023276951-A1 MEDICAL TREATMENT MATERIAL AND METHOD FOR PRODUCING SAME 東亞合成株式会社 2023-01-05 WO disclosed
WO-2023276950-A1 MEDICAL TREATMENT MATERIAL AND METHOD FOR PRODUCING SAME 東亞合成株式会社 2023-01-05 WO disclosed
EP-4077429-A1 MOISTURE CURABLE POLYACRYLATE COMPOSITIONS AND USES THEREOF Henkel AG & Co. KGaA (DE) 2022-10-26 EP disclosed
CN-110312775-B Adhesive composition and method for producing same 东亚合成株式会社 2022-09-23 CN disclosed
CN-113423786-B Compounds which can be crosslinked by hydrosilylation 瓦克化学股份公司 2022-09-23 CN disclosed
CN-114761110-A Composite semipermeable membrane 日东电工株式会社 2022-07-15 CN disclosed
CN-111094443-B Curable composition, sealing material composition, and adhesive composition 东亚合成株式会社 2022-07-05 CN disclosed
EP-3798252-B1 POLYSILOXAZANE COMPOUND HAVING ALKOXYSILYL GROUP, PROCESS FOR PRODUCING SAME, AND COMPOSITION AND CURED PRODUCT INCLUDING SAME SHINETSU CHEMICAL CO (JP) 2022-06-29 EP disclosed
US-11360387-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2022-06-14 US disclosed
CN-112119136-B Adhesive sheet 东亚合成株式会社 2022-06-10 CN disclosed
CN-114573630-A Method for producing nitrogen-containing organooxysilane compound 信越化学工业株式会社 2022-06-03 CN disclosed
US-20220169665-A1 METHOD FOR PRODUCING NITROGEN-CONTAINING ORGANOXYSILANE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-06-02 US disclosed
US-20220169796-A1 Compounds that can be crosslinked by way of hydrosilylation reaction WACKER CHEMIE AG (DE) 2022-06-02 US disclosed
EP-4006042-A1 METHOD FOR PRODUCING NITROGEN-CONTAINING ORGANOXYSILANE COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-06-01 EP disclosed
US-20220106514-A1 ROOM TEMPERATURE-CURABLE COMPOSITION HAVING EXCELLENT SILICONE OIL RESISTANCE, AND COOLANT SEALING MATERIAL FOR MOTOR VEHICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-04-07 US disclosed
US-11279848-B2 Polysilazane composition, coated substrate, and multilayer construction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-03-22 US disclosed
CN-114144442-A Moisture curable polyacrylate compositions and uses thereof 汉高知识产权控股有限责任公司 2022-03-04 CN disclosed
CN-114040933-A Block copolymer, resin composition, and method for producing block copolymer 东亚合成株式会社 2022-02-11 CN disclosed
EP-3950774-A1 DITERMINALLY AMINE-MODIFIED PERFLUOROPOLYETHER COMPOUND AND PREPARATION THEREOF, AND LIQUID-REPELLING COMPOSITION, CURED PRODUCT AND COATED SUBSTRATE CONTAINING THE SAME Shin-Etsu Chemical Co., Ltd. (JP) 2022-02-09 EP disclosed
US-20220033581-A1 Diterminally Amine-Modified Perfluoropolyether Compound and Preparation Thereof, and Liquid-Repelling Composition, Cured Product and Coated Substrate Containing the Same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-03 US disclosed
WO-2021261585-A1 ADHESIVE COMPOSITION FOR DECORATIVE FILM, AND USE THEREOF 東亞合成株式会社 2021-12-30 WO disclosed
US-20210397093-A1 SILICON-CONTAINING UNDERLAYERS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2021-12-23 US disclosed
EP-3922663-A1 ROOM TEMPERATURE-CURABLE COMPOSITION HAVING EXCELLENT SILICONE OIL RESISTANCE, AND COOLANT SEALING MATERIAL FOR MOTOR VEHICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-12-15 EP disclosed
EP-3553066-B1 GLYCOLURIL RING-CONTAINING ORGANOSILICON COMPOUND AND MAKING METHOD SHINETSU CHEMICAL CO (JP) 2021-12-01 EP disclosed
EP-3911708-A1 COMPOUNDS THAT CAN BE CROSSLINKED BY WAY OF HYDROSILYLATION REACTION Wacker Chemie AG (DE) 2021-11-24 EP disclosed
CN-113661217-A Aqueous coating composition, substrate coated with the composition, and method of controlling biofouling of aquatic organisms using the coating composition 阿克佐诺贝尔国际涂料股份有限公司 2021-11-16 CN disclosed
CN-113423786-A Compounds which can be crosslinked by hydrosilylation 瓦克化学股份公司 2021-09-21 CN disclosed
US-11079695-B2 Toner external additive and toner CANON KABUSHIKI KAISHA (JP) 2021-08-03 US disclosed
WO-2021126988-A1 MOISTURE CURABLE POLYACRYLATE COMPOSITIONS AND USES THEREOF Henkel IP & Holding GmbH (DE) 2021-06-24 WO disclosed
WO-2021117631-A1 COMPOSITE SEMI-PERMEABLE MEMBRANE 日東電工株式会社 2021-06-17 WO disclosed
US-20210095079-A1 POLYSILOXAZANE COMPOUND HAVING ALKOXYSILYL GROUP, PROCESS FOR PRODUCING SAME, AND COMPOSITION AND CURED PRODUCT INCLUDING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-04-01 US disclosed
EP-3798252-A1 POLYSILOXAZANE COMPOUND HAVING ALKOXYSILYL GROUP, PROCESS FOR PRODUCING SAME, AND COMPOSITION AND CURED PRODUCT INCLUDING SAME Shin-Etsu Chemical Co., Ltd. (JP) 2021-03-31 EP disclosed
US-20210062040-A1 POLYSILAZANE COMPOSITION, COATED SUBSTRATE, AND MULTILAYER CONSTRUCTION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-03-04 US disclosed
WO-2020256118-A1 ADHESIVE SHEET FOR VACUUM PRESSURE MOLDING AND USE OF SAME 東亞合成株式会社 2020-12-24 WO disclosed
CN-112119136-A Adhesive sheet 东亚合成株式会社 2020-12-22 CN disclosed
CN-111971342-A Curable resin composition, block copolymer, and method for producing same 东亚合成株式会社 2020-11-20 CN disclosed
EP-3546498-B1 POLYSILAZANE COMPOSITION, COATED SUBSTRATE, AND MULTILAYER CONSTRUCTION SHINETSU CHEMICAL CO (JP) 2020-10-07 EP disclosed
WO-2020192873-A1 COMPOUNDS THAT CAN BE CROSSLINKED BY WAY OF HYDROSILYLATION REACTION WACKER CHEMIE AG (DE) 2020-10-01 WO disclosed
US-20200301303-A1 TONER EXTERNAL ADDITIVE AND TONER CANON KABUSHIKI KAISHA (JP) 2020-09-24 US disclosed
WO-2020162132-A1 ROOM TEMPERATURE-CURABLE COMPOSITION HAVING EXCELLENT SILICONE OIL RESISTANCE, AND COOLANT SEALING MATERIAL FOR MOTOR VEHICLE 信越化学工業株式会社 2020-08-13 WO disclosed
US-10683312-B2 Glycoluril ring-containing organosilicon compound and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-16 US disclosed
CN-111094443-A Curable composition, sealing material composition, and adhesive composition 东亚合成株式会社 2020-05-01 CN disclosed
CN-111094442-A Curable composition, sealing material composition, and adhesive composition 东亚合成株式会社 2020-05-01 CN disclosed
CN-110941142-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2020-03-31 CN disclosed
WO-2020032163-A1 ADHESIVE COMPOSITION AND USE THEREOF 東亞合成株式会社 2020-02-13 WO disclosed
CN-106104381-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2019-12-13 CN disclosed
US-20190315779-A1 GLYCOLURIL RING-CONTAINING ORGANOSILICON COMPOUND AND MAKING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-10-17 US disclosed
EP-3553066-A1 GLYCOLURIL RING-CONTAINING ORGANOSILICON COMPOUND AND MAKING METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2019-10-16 EP disclosed
EP-3546498-A1 POLYSILAZANE COMPOSITION, COATED SUBSTRATE, AND MULTILAYER CONSTRUCTION Shin-Etsu Chemical Co., Ltd. (JP) 2019-10-02 EP disclosed
EP-1371670-B1 NOVEL POLYMER AND LIQUID GASKET FOR IN-PLACE FORMING KANEKA CORP (JP) 2019-03-27 EP disclosed
US-20190041751-A1 SILICON-CONTAINING UNDERLAYERS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2019-02-07 US disclosed
US-10160863-B2 Primer coating composition for aluminum wheels KANSAI PAINT CO., LTD. (JP) 2018-12-25 US disclosed
US-20180164685-A1 METHOD USING SILICON-CONTAINING UNDERLAYERS ROHM & HAAS ELECT MAT (US) 2018-06-14 US disclosed
US-20180164686-A1 METHOD USING SILICON-CONTAINING UNDERLAYERS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2018-06-14 US disclosed
EP-2902462-B1 STRUCTURAL BODY KANEKA CORP (JP) 2017-01-11 EP disclosed
US-20150266271-A1 STRUCTURAL BODY KANEKA CORPORATION (JP) 2015-09-24 US disclosed
EP-2902462-A1 STRUCTURAL BODY Kaneka Corporation (JP) 2015-08-05 EP disclosed
US-20150210862-A1 PRIMER COATING COMPOSITION FOR ALUMINUM WHEELS KANSAI PAINT CO., LTD. (JP) 2015-07-30 US disclosed
US-8974627-B2 Curable compositions containing silyl groups, and use thereof EVONIK DEGUSSA GMBH (DE) 2015-03-10 US disclosed
EP-1731549-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2013-07-03 EP disclosed
EP-1598402-B1 CURABLE COMPOSITIONS KANEKA CORP (JP) 2012-05-02 EP disclosed
US-20120067520-A1 Curable Compositions Containing Silyl Groups, And Use Thereof EVONIK GOLDSCHMIDT GMBH (DE) 2012-03-22 US disclosed
EP-1642932-B1 CURING COMPOSITION KANEKA CORP (JP) 2012-03-21 EP disclosed
EP-1978061-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2011-11-09 EP disclosed
EP-1586605-B1 POLYMER AND CURABLE COMPOSITIONS IMPROVED IN STORAGE STABILITY KANEKA CORP (JP) 2011-11-02 EP disclosed
EP-1591488-B1 Curable compositions and compatibilizing agent KANEKA CORP (JP) 2011-08-31 EP disclosed
EP-2352799-A1 HIGHLY HYDROPHOBIC COATINGS Wacker Chemie AG (DE) 2011-08-10 EP disclosed
US-7977399-B2 Curable composition KANEKA CORPORATION (JP) 2011-07-12 US disclosed
EP-1961786-B1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL KANEKA CORP (JP) 2011-04-06 EP disclosed
US-7863399-B2 Curing silicone composition and cured product thereof Dow Corning Toray Company, Ltd (JP) 2011-01-04 US disclosed
US-20100222449-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2010-09-02 US disclosed
EP-2072577-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2010-08-04 EP disclosed
EP-1789170-B1 RHEOLOGY CONTROL OF PICKERING EMULSIONS BY ELECTROLYTES WACKER CHEMIE AG (DE) 2010-07-14 EP disclosed
WO-2010063710-A1 HIGHLY HYDROPHOBIC COATINGS WACKER CHEMIE AG (DE) 2010-06-10 WO disclosed
EP-1727865-B1 PARTICLE-STABILISED EMULSIONS WACKER CHEMIE AG (DE) 2010-05-19 EP disclosed
EP-1637565-B1 CURING COMPOSITION KANEKA CORP (JP) 2010-05-05 EP disclosed
US-20090292075-A1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL KANEKA CORPORATION (JP) 2009-11-26 US disclosed
US-20090275705-A1 Acrylic Block Copolymer and Reactive Hot-Melt Adhesive Compositions KANEKA CORPORATION (JP) 2009-11-05 US disclosed
US-7601781-B2 Curable compositions KANEKA CORPORATION (JP) 2009-10-13 US disclosed
US-20090234072-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-09-17 US disclosed
US-20090192265-A1 Curable composition KANEKA CORPORATION (JP) 2009-07-30 US disclosed
EP-1652884-B1 Curable compositions KANEKA CORP (JP) 2009-07-08 EP disclosed
EP-2072577-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-06-24 EP disclosed
EP-1000979-B1 CURABLE ADHESIVE COMPOSITION KANEKA CORP (JP) 2009-05-13 EP disclosed
US-7511102-B2 Polymer and liquid gasket for In-Place forming KANEKA CORPORATION (JP) 2009-03-31 US disclosed
WO-2009031859-A2 MULTI-FUNCTIONAL COMPLEX FOR IMAGING AND DRUG DELIVERY ANYGEN CO., LTD. (KR) 2009-03-12 WO disclosed
EP-1153950-B1 RESIN COMPOSITION, POLYMER, AND PROCESS FOR PRODUCING POLYMER KANEKA CORP (JP) 2009-03-11 EP disclosed
US-20090041673-A1 Thermally Crosslinked Contrast Agents ANYGEN CO., LTD. (KR) 2009-02-12 US disclosed
US-20090012237-A1 CURABLE COMPOSITION AND COMPATIBILIZING AGENT KANEKA CORPORATION (JP) 2009-01-08 US disclosed
EP-1978061-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-10-08 EP disclosed
EP-1702938-B1 CURABLE SILICONE COMPOSITION AND ITS USE AS ADHESIVE DOW CORNING TORAY CO LTD (JP) 2008-09-24 EP disclosed
EP-1961786-A1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL Kaneka Corporation (JP) 2008-08-27 EP disclosed
EP-1288247-B1 CURABLE COMPOSITIONS AND COMPATIBILIZING AGENT KANEKA CORP (JP) 2008-07-16 EP disclosed
EP-1923431-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-05-21 EP disclosed
US-20080051517-A1 Curable Composition KANEKA CORPORATION 2008-02-28 US disclosed
EP-1264857-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2008-01-09 EP disclosed
EP-1865003-A1 ACRYLIC BLOCK COPOLYMER AND REACTIVE HOT-MELT ADHESIVE COMPOSITIONS Kaneka Corporation (JP) 2007-12-12 EP disclosed
US-20070282058-A1 Curing Silicone Composition and Cured Product Thereof DOW TORAY CO., LTD. (JP) 2007-12-06 US disclosed
US-20070161732-A1 Novel polymer and liquid gasket for In-Place forming KANEKA CORPORATION (JP) 2007-07-12 US disclosed
US-20070161768-A1 Method for producing hydrolyzable silicon group-containing oxyalkylene polymer and curing composition thereof KANEKA CORPORATION (JP) 2007-07-12 US disclosed
EP-1789170-A1 RHEOLOGY CONTROL OF PICKERING EMULSIONS BY ELECTROLYTES Wacker Chemie AG (DE) 2007-05-30 EP disclosed
EP-1786552-A1 METHOD OF MAKING POLYMER MONOLITH COMPOSITE SUBSTRATE AND RESULTING SUBSTRATE AS WELL AS BEADS AND BEAD ARRAY Applera Corporation (US) 2007-05-23 EP disclosed
US-7186780-B2 Polymer and liquid gasket for in-place forming KANEKA CORPORATION (JP) 2007-03-06 US disclosed
EP-1731549-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-12-13 EP disclosed
EP-1731544-A1 HARDENABLE COMPOSITION KANEKA CORPORATION (JP) 2006-12-13 EP disclosed
EP-1727865-A1 PARTICLE-STABILISED EMULSIONS Wacker Chemie AG (DE) 2006-12-06 EP disclosed
US-20060247376-A1 Curing composition KANEKA CORPORATION (JP) 2006-11-02 US disclosed
US-7129294-B2 Functional groups-terminated vinyl polymers KANEKA CORPORATION (JP) 2006-10-31 US disclosed
EP-1710270-A1 METHOD FOR PRODUCING HYDROLYZABLE SILICON GROUP-CONTAINING OXYALKYLENE POLYMER AND CURING COMPOSITION THEREOF Kaneka Medix Corporation (JP) 2006-10-11 EP disclosed
EP-1702938-A1 CURING SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW CORNING TORAY CO., LTD. (JP) 2006-09-20 EP disclosed
US-20060205887-A1 Polymer and curable compositions improved in storage stability KANEKA CORPORATION (JP) 2006-09-14 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1652884-A1 Curable compositions Kaneka Corporation (JP) 2006-05-03 EP disclosed
EP-1179567-B1 CURABLE COMPOSITIONS KANEKA CORP (JP) 2006-04-26 EP disclosed
US-7030194-B1 Method of treating polymer KANEKA CORPORATION (JP) 2006-04-18 US disclosed
US-20060079645-A1 Curable compositions KANEKA CORPORATION (JP) 2006-04-13 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
WO-2006026378-A1 METHOD OF MAKING POLYMER MONOLITH COMPOSITE SUBSTRATE AND RESULTING SUBSTRATE AS WELL AS BEADS AND BEAD ARRAY APPLERA CORPORATION (US) 2006-03-09 WO disclosed
EP-1630186-A1 CURING COMPOSITION Kaneka Corporation (JP) 2006-03-01 EP disclosed
WO-2006018112-A1 RHEOLOGY CONTROL OF PICKERING EMULSIONS BY ELECTROLYTES WACKER CHEMIE AG (DE) 2006-02-23 WO disclosed
EP-1607460-A2 Moisture setting composition and adhesive composition TOAGOSEI CO., LTD. (JP) 2005-12-21 EP disclosed
EP-1598402-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2005-11-23 EP disclosed
EP-1591488-A2 Curable compositions and compatibilizing agent KANEKA CORPORATION (JP) 2005-11-02 EP disclosed
EP-1586605-A1 POLYMER AND CURABLE COMPOSITIONS IMPROVED IN STORAGE STABILITY KANEKA CORPORATION (JP) 2005-10-19 EP disclosed
WO-2005092989-A1 PARTICLE-STABILISED EMULSIONS WACKER CHEMIE AG (DE) 2005-10-06 WO disclosed
EP-1526153-A1 Aqueous polymer dispersions Wacker-Chemie GmbH (DE) 2005-04-27 EP disclosed
US-6838499-B2 Comprising liquid base polymer, silicone elastomer powder, and crosslinking agent in putty form prior to curing; tack-free to the hand, easy to work, and adherent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-01-04 US disclosed
US-6831130-B2 A blends comprising a polyether with a crosslinkable functional group and a vinyl polymer; storage stability, high elongation, weatherability KANEKA CORPORATION (JP) 2004-12-14 US disclosed
US-6784240-B2 COMPRISES A VINYL POLYMER HAVING AT LEAST ONE CROSSLINKING SILYL GROUP, TOGETHER WITH HEAVY OR GROUND CALCIUM CARBONATE KANEKA CORPORATION (JP) 2004-08-31 US disclosed
EP-1000980-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-07-07 EP disclosed
US-20040113311-A1 Novel polymer and liquid gasket for in-place forming KANEKA CORPORATION (JP) 2004-06-17 US disclosed
US-6706260-B1 COMPRISED OF POLYMER HAVING SUCH AS 2-METHACRYLOYLOXYETHYL PHOSPHORYLCHOLINE UNITS; CLEANING AND NECROTIC TISSUE REMOVAL; NONIRRITATING; ACCELERATING REEPITHELIALIZATION AND GRANULATION NOF CORPORATION (JP) 2004-03-16 US disclosed
US-20040029990-A1 Curable compositions KANEKA CORPORATION (JP) 2004-02-12 US disclosed
EP-1371670-A1 NOVEL POLYMER AND LIQUID GASKET FOR IN-PLACE FORMING KANEKA CORPORATION (JP) 2003-12-17 EP disclosed
US-20030176576-A1 Curable compositions and compatibilizing agent KANEKA CORPORATION (JP) 2003-09-18 US disclosed
US-20030166739-A1 Curable compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-09-04 US disclosed
US-20030166756-A1 Curable composition KANEKA CORPORATION (JP) 2003-09-04 US disclosed
US-6552118-B2 Curable acrylate polymer containing crosslinkable silyl group, wherein acrylate polymer is produced by living radical polymerization KANEKA CORPORATION (JP) 2003-04-22 US disclosed
EP-1288247-A1 CURABLE COMPOSITIONS AND COMPATIBILIZING AGENT KANEKA CORPORATION (JP) 2003-03-05 EP disclosed
EP-1264857-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2002-12-11 EP disclosed
US-6479584-B1 Resin composition, polymer, and process for producing polymer KANEKA CORPORATION (JP) 2002-11-12 US disclosed
EP-0735100-B1 Curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 2002-10-02 EP disclosed
US-20020137841-A1 Functional groups-terminated vinyl polymers KANEKA CORPORATION (JP) 2002-09-26 US disclosed
US-20020086942-A1 CURABLE ADHESIVE COMPOSITION KANEKA CORPORATION (JP) 2002-07-04 US disclosed
US-6407146-B1 BLEND OF VINYL POLYMER AND POLYETHER BOTH WITH CROSSLINKABLE SILYL GROUPS; ELASTICITY; PRESSURE SENSITIVE ADHESIVES; SEALS; WEATHERPROOF KANEKA CORPORATION (JP) 2002-06-18 US disclosed
WO-2002028912-A2 PREPARATION OF NANOCOMPOSITE STRUCTURES BY CONTROLLED POLYMERIZATION CARNEGIE MELLON UNIVERSITY (US) 2002-04-11 WO disclosed
EP-1179567-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2002-02-13 EP disclosed
EP-1153950-A1 RESIN COMPOSITION, POLYMER, AND PROCESS FOR PRODUCING POLYMER KANEKA CORPORATION (JP) 2001-11-14 EP disclosed
US-6274688-B1 CROSSLINKING KANEKA CORPORATION (JP) 2001-08-14 US disclosed
EP-1095665-A1 WOUND-COVERING PREPARATION, WOUND-COVERING MATERIAL, AND METHOD OF WOUND HEALING NOF CORPORATION (JP) 2001-05-02 EP disclosed
EP-1000980-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-17 EP disclosed
EP-1000979-A1 CURABLE ADHESIVE COMPOSITION KANEKA CORPORATION (JP) 2000-05-17 EP disclosed
EP-0571965-B1 Curable silicone composition DOW CORNING TORAY SILICONE (JP) 1998-10-21 EP disclosed
EP-0664322-B1 Curable organopolysiloxane composition with condensation reaction curing and addition reaction curing DOW CORNING TORAY SILICONE (JP) 1998-07-01 EP disclosed
EP-0632099-B1 Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICONE (JP) 1997-11-12 EP disclosed
EP-0639606-B1 Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICONE (JP) 1997-05-21 EP disclosed
JP-H09124922-A ROOM TEMPERATURE CURING COMPOSITION ASAHI GLASS CO LTD 1997-05-13 JP disclosed
US-5625022-A Curable organopolysiloxane composition DOW CORNING TORAY SILICONE CO., LTD. (JP) 1997-04-29 US disclosed
EP-0567079-B1 Curable resin composition DOW CORNING TORAY SILICONE (JP) 1997-03-26 EP disclosed
EP-0735100-A2 Curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1996-10-02 EP disclosed
US-5530075-A CURABLE RESIN, ORGANOPOLYSILOXANE HAVING EPOXY GROUPS DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-06-25 US disclosed
US-5504174-A ADHESIVE COMPRISING ALKOXY-CONTAINING POLYSILOXANE, ALKENYL-CONTAINING POLYSILOXANE, AN ORGANOHYDROGENSILOXANE, AN ALKOXYSILANE, A TITANIUM CATALYST AND A HYDROSILATION CATALYST; BONDING STRENGTH DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-04-02 US disclosed
US-5486588-A Epoxy-functional organopolysiloxane from SiH polysiloxane, unsaturated epoxy compound and alkene DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 1996-01-23 US disclosed
US-5468827-A Epoxy-functional MQ organopolysiloxanes DOW CORNING TORAY SILICON CO., LTD. (JP) 1995-11-21 US disclosed
EP-0664322-A1 Curable organopolysiloxane composition with condensation reaction curing and addition reaction curing Dow Corning Toray Silicone Company, Limited (JP) 1995-07-26 EP disclosed
US-5422412-A Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICON CO., LTD (JP) 1995-06-06 US disclosed
EP-0639606-A1 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-02-22 EP disclosed
EP-0632099-A2 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-01-04 EP disclosed
US-5358983-A Flexible, heat resistance, hardness DOW CORNING TORAY SILICONE CO., LTD. (JP) 1994-10-25 US disclosed
JP-H06107941-A CURABLE COMPOSITION ASAHI GLASS CO LTD 1994-04-19 JP disclosed
JP-H0665494-A ROOM TEMPERATURE CURING COMPOSITION ASAHI GLASS CO LTD 1994-03-08 JP disclosed
JP-H0616922-A CURABLE COMPOSITION ASAHI GLASS CO LTD 1994-01-25 JP disclosed
EP-0571965-A1 Curable silicone composition Dow Corning Toray Silicone Company, Limited (JP) 1993-12-01 EP disclosed
JP-H05295247-A COLD-SETTABLE COMPOSITION ASAHI GLASS CO LTD 1993-11-09 JP disclosed
EP-0567079-A1 Curable resin composition Dow Corning Toray Silicone Company, Limited (JP) 1993-10-27 EP disclosed
JP-H05194679-A PRODUCTION OF COMPOSITION AND CURABLE COMPOSITION CONTAINING THE SAME ASAHI GLASS CO LTD 1993-08-03 JP disclosed
JP-H05194679-A PRODUCTION OF COMPOSITION AND CURABLE COMPOSITION CONTAINING THE SAME ASAHI GLASS CO LTD 1993-08-03 JP disclosed