⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3343488 | 1.00 | — | — | |
| SCHEMBL4194676 | 0.82 | TRPA1 (0.35) | — | |
| SCHEMBL4353686 | 0.79 | — | — | |
| SCHEMBL4353689 | 0.79 | — | — | |
| SCHEMBL6064212 | 0.78 | — | — | |
| SCHEMBL3337761 | 0.76 | TRPA1 (0.32) | — | |
| SCHEMBL3337758 | 0.76 | TRPA1 (0.32) | — | |
| SCHEMBL3082948 | 0.75 | TSHR (0.33) | — | |
| SCHEMBL3082951 | 0.75 | TSHR (0.33) | — | |
| SCHEMBL17474339 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5651921-A | Process for preparing a water repellent silica sol | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1997-07-29 | — | — | US | claimed |
| US-20220153583-A1 | BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER | DENKA COMPANY LIMITED (JP) | 2022-05-19 | — | — | US | disclosed |
| US-8968458-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2015-03-03 | — | — | US | disclosed |
| US-8808446-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2014-08-19 | — | — | US | disclosed |
| EP-1989253-B1 | CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF | DOW CORNING TORAY CO LTD (JP) | 2013-10-02 | — | — | EP | disclosed |
| EP-2024439-B1 | CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF | DOW CORNING TORAY CO LTD (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20100151384-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20090298980-A1 | Curable Silicone Resin Composition and Cured Body Thereof | DOW CORNING TORAY CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090099321-A1 | Curable Silicone Resin Composition and Cured Body Thereof | DOW CORNING TORAY COMPANY, LTD. (JP) | 2009-04-16 | — | — | US | disclosed |
| US-20090050020-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2009-02-26 | — | — | US | disclosed |
| US-5486588-A | Epoxy-functional organopolysiloxane from SiH polysiloxane, unsaturated epoxy compound and alkene | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 1996-01-23 | — | — | US | disclosed |
| US-5468827-A | Epoxy-functional MQ organopolysiloxanes | DOW CORNING TORAY SILICON CO., LTD. (JP) | 1995-11-21 | — | — | US | disclosed |
| US-5422412-A | Organopolysiloxane and method for the preparation thereof | DOW CORNING TORAY SILICON CO., LTD (JP) | 1995-06-06 | — | — | US | disclosed |
| EP-0639606-A1 | Organopolysiloxane and method for the preparation thereof | Dow Corning Toray Silicone Company, Limited (JP) | 1995-02-22 | — | — | EP | disclosed |
| EP-0632099-A2 | Organopolysiloxane and method for the preparation thereof | Dow Corning Toray Silicone Company, Limited (JP) | 1995-01-04 | — | — | EP | disclosed |
| EP-0586240-A2 | Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom | DOW CORNING CORPORATION (US) | 1994-03-09 | — | — | EP | disclosed |
| EP-0586241-A1 | Azasilacycloalkyl functional alkoxysilanes and azasilacycloalkyl functional tetramethyldisiloxanes | DOW CORNING CORPORATION (US) | 1994-03-09 | — | — | EP | disclosed |
| US-5276123-A | Endblocking polysiloxanes | DOW CORNING CORPORATION (US) | 1994-01-04 | — | — | US | disclosed |
| US-5239099-A | Room temperature vulcanization; noncorrosive byproducts | DOW CORNING CORPORATION (US) | 1993-08-24 | — | — | US | disclosed |
| EP-0475132-A1 | Water repellent silica sol and process for preparing the same | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1992-03-18 | — | — | EP | disclosed |