SCHEMBL3343488

SCHEMBL3343488

CCC=C[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3343486 1.00
SCHEMBL4194676 0.82 TRPA1 (0.35)
SCHEMBL4353686 0.79
SCHEMBL4353689 0.79
SCHEMBL6064212 0.78
SCHEMBL3337761 0.76 TRPA1 (0.32)
SCHEMBL3337758 0.76 TRPA1 (0.32)
SCHEMBL3082948 0.75 TSHR (0.33)
SCHEMBL3082951 0.75 TSHR (0.33)
SCHEMBL17474339 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5651921-A Process for preparing a water repellent silica sol IDEMITSU KOSAN COMPANY LIMITED (JP) 1997-07-29 US claimed
CN-113614033-B Block-shaped boron nitride particles, heat-conductive resin composition, and heat-dissipating member 电化株式会社 2024-04-30 CN disclosed
CN-111875735-B Silane polymer for bonding lithium ion battery negative electrode and preparation method thereof 湖北大学 2022-08-02 CN disclosed
US-20220153583-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER DENKA COMPANY LIMITED (JP) 2022-05-19 US disclosed
CN-105315675-A Ultraviolet light-curing composition UNIV SHANGHAI JIAOTONG 2016-02-10 CN disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
US-20130345370-A1 SILICONE RESIN COMPOSITION NITTO DENKO CORPORATION (JP) 2013-12-26 US disclosed
EP-2677006-A1 Silicone resin composition NITTO DENKO CORPORATION (JP) 2013-12-25 EP disclosed
EP-1989253-B1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2013-10-02 EP disclosed
US-5486588-A Epoxy-functional organopolysiloxane from SiH polysiloxane, unsaturated epoxy compound and alkene DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 1996-01-23 US disclosed
US-5468827-A Epoxy-functional MQ organopolysiloxanes DOW CORNING TORAY SILICON CO., LTD. (JP) 1995-11-21 US disclosed
US-5422412-A Organopolysiloxane and method for the preparation thereof DOW CORNING TORAY SILICON CO., LTD (JP) 1995-06-06 US disclosed
EP-0639606-A1 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-02-22 EP disclosed
EP-0632099-A2 Organopolysiloxane and method for the preparation thereof Dow Corning Toray Silicone Company, Limited (JP) 1995-01-04 EP disclosed
EP-0586240-A2 Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom DOW CORNING CORPORATION (US) 1994-03-09 EP disclosed
EP-0586241-A1 Azasilacycloalkyl functional alkoxysilanes and azasilacycloalkyl functional tetramethyldisiloxanes DOW CORNING CORPORATION (US) 1994-03-09 EP disclosed
US-5276123-A Endblocking polysiloxanes DOW CORNING CORPORATION (US) 1994-01-04 US disclosed
US-5239099-A Room temperature vulcanization; noncorrosive byproducts DOW CORNING CORPORATION (US) 1993-08-24 US disclosed
EP-0475132-A1 Water repellent silica sol and process for preparing the same IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-03-18 EP disclosed