SCHEMBL755413

SCHEMBL755413

CC(C)CCCCCOC(CCCCCC(C)C)(CC(=O)[O-])C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.31
GPR84 Q9NQS5 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL673662 0.90 CES2 (0.35)
SCHEMBL756607 0.90 CES2 (0.35)
SCHEMBL4441140 0.88 CES2 (0.35)
SCHEMBL4445258 0.88 CES2 (0.35)
SCHEMBL673040 0.88 CES2 (0.35)
SCHEMBL756682 0.85 CA1 (0.30) CA1
SCHEMBL675592 0.84 CES2 (0.33)
SCHEMBL673117 0.82 CES2 (0.34) CA1GPR84
SCHEMBL673172 0.78 CA2 (0.39)
SCHEMBL673788 0.78 CES2 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111989379-B Building with wall structure and method for manufacturing wall structure 思美定株式会社 2024-02-20 CN disclosed
WO-2023048155-A1 ONE-PACK TYPE CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-03-30 WO disclosed
CN-115038753-A Composition, curable composition, cured product and storage method 株式会社钟化 2022-09-09 CN disclosed
WO-2022030284-A1 BASE COAT AGENT FOR COATING-TYPE BODY CORRECTIVE FILM AND METHOD FOR USING SAME 株式会社 資生堂 2022-02-10 WO disclosed
US-20210087438-A1 ADHESIVE COMPOSITION FOR BATTERIES AND ADHESIVE MEMBER FOR BATTERIES USING SAME TOAGOSEI CO., LTD. (JP) 2021-03-25 US disclosed
CN-111989379-A Building with wall structure and method for manufacturing wall structure 思美定株式会社 2020-11-24 CN disclosed
EP-3178872-B1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORP (JP) 2019-06-19 EP disclosed
US-20170226305-A1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORPORATION (JP) 2017-08-10 US disclosed
EP-3178872-A1 MODIFIED SILICONE RESIN FOAMED BODY Kaneka Corporation (JP) 2017-06-14 EP disclosed
US-8277555-B2 Coating composition DYFLEX CORPORATION (JP) 2012-10-02 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed