Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 3/20 | 0.35 |
| ▸ | NAAA | Q02083 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL673662 | 1.00 | CES2 (0.35) | CES2NAAAEPHX1 | |
| SCHEMBL4441140 | 0.97 | CES2 (0.35) | CES2NAAAEPHX1 | |
| SCHEMBL4445258 | 0.97 | CES2 (0.35) | CES2NAAAEPHX1 | |
| SCHEMBL673040 | 0.97 | CES2 (0.35) | CES2NAAAEPHX1 | |
| SCHEMBL756682 | 0.92 | CA1 (0.30) | — | |
| SCHEMBL755413 | 0.90 | CA1 (0.31) | — | |
| SCHEMBL673788 | 0.86 | CES2 (0.35) | CES2NAAAEPHX1 | |
| SCHEMBL675592 | 0.86 | CES2 (0.33) | CES2 | |
| SCHEMBL673117 | 0.85 | CES2 (0.34) | CES2NAAA | |
| SCHEMBL673172 | 0.82 | CA2 (0.39) | CES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240262965-A1 | MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF | KANEKA CORPORATION (JP) | 2024-08-08 | — | — | US | disclosed |
| WO-2023068083-A1 | MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF | 株式会社カネカ | 2023-04-27 | — | — | WO | disclosed |
| WO-2023013487-A1 | MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF | 株式会社カネカ | 2023-02-09 | — | — | WO | disclosed |
| WO-2021256180-A1 | URETHANE ADHESIVE COMPOSITION | シーカ・ハマタイト株式会社 | 2021-12-23 | — | — | WO | disclosed |
| US-20210087438-A1 | ADHESIVE COMPOSITION FOR BATTERIES AND ADHESIVE MEMBER FOR BATTERIES USING SAME | TOAGOSEI CO., LTD. (JP) | 2021-03-25 | — | — | US | disclosed |
| WO-2019203034-A1 | BUILDING HAVING WALL STRUCTURE AND METHOD FOR PRODUCING WALL STRUCTURE | セメダイン株式会社 | 2019-10-24 | — | — | WO | disclosed |
| EP-3178872-B1 | MODIFIED SILICONE RESIN FOAMED BODY | KANEKA CORP (JP) | 2019-06-19 | — | — | EP | disclosed |
| US-20170226305-A1 | MODIFIED SILICONE RESIN FOAMED BODY | KANEKA CORPORATION (JP) | 2017-08-10 | — | — | US | disclosed |
| EP-3178872-A1 | MODIFIED SILICONE RESIN FOAMED BODY | Kaneka Corporation (JP) | 2017-06-14 | — | — | EP | disclosed |
| EP-1642932-B1 | CURING COMPOSITION | KANEKA CORP (JP) | 2012-03-21 | — | — | EP | disclosed |
| US-20060135709-A1 | Curing composition | KANEKA CORPORATION (JP) | 2006-06-22 | — | — | US | disclosed |
| EP-1642932-A1 | CURING COMPOSITION | KANEKA CORPORATION (JP) | 2006-04-05 | — | — | EP | disclosed |
| EP-1637565-A1 | CURING COMPOSITION | KANEKA CORPORATION (JP) | 2006-03-22 | — | — | EP | disclosed |
| EP-1619219-A1 | CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2006-01-25 | — | — | EP | disclosed |
| EP-1057861-B1 | Use of a crosslinked product as a heat-sensitive elastic adhesive | KANEKA CORP (JP) | 2004-11-24 | — | — | EP | disclosed |
| EP-1004628-B1 | CURABLE COMPOSITION | KANEKA CORP (JP) | 2004-02-25 | — | — | EP | disclosed |
| US-6426392-B1 | REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS | KANEKA CORPORATION (JP) | 2002-07-30 | — | — | US | disclosed |
| US-6335412-B1 | POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS | KANEKA CORPORATION (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-1057861-A2 | Thermoplastic crosslinked product and heat-sensitive elastic adhesive | KANEKA CORPORATION (JP) | 2000-12-06 | — | — | EP | disclosed |
| EP-1004628-A1 | CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2000-05-31 | — | — | EP | disclosed |