SCHEMBL757144

SCHEMBL757144

Cc1cc(O)c(C2CCCCC2)cc1C(c1cccc(O)c1)c1cc(C2CCCCC2)c(O)cc1C

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 1/20 0.40
OPRM1 P35372 1/20 0.40
KDR P35968 1/20 0.40
SLC6A3 Q01959 1/20 0.40
OPRD1 P41143 1/20 0.36
OPRK1 P41145 1/20 0.36
NUDT1 P36639 1/20 0.35
BACE1 P56817 1/20 0.35
HSP90AA1 P07900 1/20 0.35
ALDH1A1 P00352 1/20 0.34
SIGMAR1 Q99720 3/20 0.34
DRD4 P21917 2/20 0.34
DRD3 P35462 2/20 0.34
NFKB1 P19838 1/20 0.34
PRCP P42785 1/20 0.34
EBP Q15125 1/20 0.34
DRD2 P14416 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30374841 1.00 SLC6A4 (0.40) SLC6A4OPRM1KDRSLC6A3OPRD1
SCHEMBL29373431 1.00 SLC6A4 (0.40) SLC6A4OPRM1KDRSLC6A3OPRD1
SCHEMBL30103811 0.88 SLC6A4 (0.40) SLC6A4OPRM1KDRSLC6A3OPRD1
SCHEMBL278752 0.88 NUDT1 (0.37) OPRM1OPRD1OPRK1NUDT1BACE1
SCHEMBL28899040 0.88 SLC6A4 (0.40) SLC6A4OPRM1KDRSLC6A3OPRD1
SCHEMBL29499852 0.85 NUDT1 (0.37) NUDT1BACE1HSP90AA1
SCHEMBL36658 0.85 NUDT1 (0.37) NUDT1BACE1HSP90AA1
SCHEMBL29372915 0.85 NUDT1 (0.37) NUDT1BACE1HSP90AA1
SCHEMBL17222748 0.85 SLC6A4 (0.31) SLC6A4OPRM1KDRSLC6A3
SCHEMBL36430 0.84 HIF1A (0.39) NUDT1BACE1HSP90AA1ALDH1A1DRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 349 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US claimed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
CN-118325004-A Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film DIC株式会社 2024-07-12 CN disclosed
CN-114902135-B Positive photosensitive resin composition, cured film, and resist film DIC株式会社 2024-07-02 CN disclosed
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 CN disclosed
CN-117939914-A Structure, display element, pattern for partition wall, and method for forming the same 东京应化工业株式会社 2024-04-26 CN disclosed
CN-117321109-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-12-29 CN disclosed
CN-111205648-B Curable composition, cured product, microlens, and optical element 东京应化工业株式会社 2023-12-08 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
CN-117106358-A Composition for forming separation layer, support substrate with separation layer, laminate, method for producing laminate, and method for producing electronic component 东京应化工业株式会社 2023-11-24 CN disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5702862-A ALKALI SOLUBLE RESIN; A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5677102-A DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING TOKYO OHKA KOGYO CO., LTD. (JP) 1997-10-14 US disclosed
US-5604077-A MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-18 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed
US-5401605-A Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound TOKYO OHKA KOGYO CO., LTD. (JP) 1995-03-28 US disclosed