Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.44 |
| ▸ | CA2 | P00918 | 2/20 | 0.44 |
| ▸ | CA7 | P43166 | 2/20 | 0.44 |
| ▸ | CA9 | Q16790 | 2/20 | 0.44 |
| ▸ | CA12 | O43570 | 1/20 | 0.44 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 1/20 | 0.38 |
| ▸ | SNCA | P37840 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.36 |
| ▸ | ORAI1 | Q96D31 | 1/20 | 0.36 |
| ▸ | ORAI2 | Q96SN7 | 1/20 | 0.36 |
| ▸ | ORAI3 | Q9BRQ5 | 1/20 | 0.36 |
| ▸ | TRPV6 | Q9H1D0 | 1/20 | 0.36 |
| ▸ | NPC1 | O15118 | 2/20 | 0.35 |
| ▸ | RAB9A | P51151 | 2/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14983500 | 0.92 | CA1 (0.48) | CA1CA2CA7CA9CA12 | |
| SCHEMBL223577 | 0.84 | CYP2A6 (0.44) | CA1CA7CA9CA12CA14 | |
| SCHEMBL3686725 | 0.82 | — | — | |
| SCHEMBL31336177 | 0.82 | NPSR1 (0.42) | CA1CA2CA7CA9CA12 | |
| SCHEMBL31336176 | 0.82 | NPSR1 (0.42) | CA1CA2CA7CA9CA12 | |
| SCHEMBL12129626 | 0.78 | MAOB (0.38) | MAPK1ALDH1A1 | |
| SCHEMBL6826334 | 0.78 | ACHE (0.41) | CA1CA2CA7CA9ACHE | |
| SCHEMBL2273369 | 0.77 | SNCA (0.56) | CA1CA2CA7CA9CA12 | |
| SCHEMBL7591877 | 0.77 | ACHE (0.36) | ACHETDP1ORAI1ORAI2ORAI3 | |
| SCHEMBL4266621 | 0.76 | LPL (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-2023162551-A1 | METHOD FOR PRODUCING PLATED SHAPED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-20210356863-A1 | CHEMICAL AMPLIFICATION-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF PATTERNED RESIST LAYER, PRODUCTION METHOD OF PLATED MOLDED ARTICLE, COMPOUND, AND PRODUCTION METHOD OF COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-11-18 | — | — | US | disclosed |
| US-20200209739-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| US-20200150541-A1 | METHOD OF FORMING RESIST PATTERN, RESIST COMPOSITION AND METHOD OF PRODUCING THE SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-05-14 | — | — | US | disclosed |
| US-20200033729-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-01-30 | — | — | US | disclosed |
| US-8945820-B2 | Silicon-containing resist underlayer film-forming composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-02-03 | — | — | US | disclosed |
| US-8945820-B2 | Silicon-containing resist underlayer film-forming composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-02-03 | — | — | US | disclosed |
| US-20130137271-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-05-30 | — | — | US | disclosed |
| US-20130137271-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-05-30 | — | — | US | disclosed |
| EP-0675118-B1 | Biphenylderivatives, process for their preparation and their use as medicaments | EISAI CO LTD (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6281214-B1 | USEFUL FOR TREATING AND AMELIORATING MENTAL DISORDERS | EISAI CO., LTD (JP) | 2001-08-28 | — | — | US | disclosed |
| EP-0675118-A2 | Biphenylderivatives, process for their preparation and their use as medicaments | Eisai Co., Ltd. (JP) | 1995-10-04 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20200209739-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND | CUTA, RAD51, PCNA | CA1 1495/4885CA2 1754/4885CA7 1324/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.