SCHEMBL7642852

SCHEMBL7642852

Cc1ccc(-c2c(O)cccc2O)c(C)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.52
TP53 P04637 1/20 0.52
CYP1A2 P05177 1/20 0.44
CYP2C19 P33261 1/20 0.44
MAPT P10636 4/20 0.43
ALDH1A1 P00352 3/20 0.43
ELANE P08246 2/20 0.43
KDM4E B2RXH2 2/20 0.43
TSHR P16473 2/20 0.43
CTSG P08311 1/20 0.43
MEN1 O00255 1/20 0.43
USP2 O75604 1/20 0.43
CYP3A4 P08684 1/20 0.43
MAPK1 P28482 1/20 0.43
BRCA1 P38398 1/20 0.43
RECQL P46063 1/20 0.43
KMT2A Q03164 1/20 0.43
TRPA1 O75762 3/20 0.43
GAA P10253 2/20 0.42
ALOX15 P16050 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2934180 0.87 ALDH1A1 (0.46) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL29351018 0.82 TP53 (0.42) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL14363376 0.81 TRPA1 (0.50) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL31049807 0.80 PDK2 (0.46) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL7604010 0.80 TP53 (0.54) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL1828915 0.79 TP53 (0.52) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL29362536 0.79 TP53 (0.52) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL1758394 0.78 TP53 (0.61) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL30250666 0.78 TP53 (0.61) TDP1TP53CYP1A2CYP2C19MAPT
SCHEMBL24523191 0.77 PDK2 (0.45) TDP1TP53CYP1A2CYP2C19MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114641534-B Resin composition and electronic and electrical device component 三菱化学株式会社 2024-02-20 CN disclosed
CN-114641534-A Resin composition and electronic and electrical device member 三菱工程塑料株式会社 2022-06-17 CN disclosed
CN-111094452-A Flame-retardant polycarbonate resin composition 住化PC有限公司 2020-05-01 CN disclosed
EP-2840117-B1 POLYCARBONATE RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2019-11-13 EP disclosed
US-9499695-B2 Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-11-22 US disclosed
US-20150086856-A1 POLYCARBONATE RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2015-03-26 US disclosed
EP-2840117-A1 POLYCARBONATE RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2015-02-25 EP disclosed
CN-102596524-B Production method for molded body of polyphenylene ether resin composition MITSUBISHI ENG PLASTICS CORP 2014-12-03 CN disclosed
CN-102869482-B Process for production of polyphenylene ether resin molded article MITSUBISHI ENG PLASTICS CORP 2014-11-05 CN disclosed
CN-102869482-A Process for production of polyphenylene ether resin molded article MITSUBISHI ENG PLASTICS CORP 2013-01-09 CN disclosed
CN-102596524-A Production method for molded body of polyphenylene ether resin composition MITSUBISHI ENG PLASTICS CORP 2012-07-18 CN disclosed
US-6369141-B1 AROMATIC POLYPHOSPHATE, POLYFLUOROETHYLENE, AND SHELL-CORE POLYMER WITH ALKYL (METH)ACRYLATE EXTERIOR LAYER; MECHANICAL PROPERTIES, HEAT RESISTANCE, STABILITY; ELECTRONICS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2002-04-09 US disclosed
US-6342550-B1 ORGANIC SULFONIC ACID METAL SALT,FLUORINATED POLYOLEFIN, DIENE MULTI-LAYERED POLYMER, PHOSPHORUS FREE; IMPACT RESISTANCE, HEAT RESISTANCE, MOLDABILITY, CHEMICAL REESISTANCE MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 2002-01-29 US disclosed
US-6177492-B1 95 TO 5 PARTS BY WEIGHT OF AN AROMATIC POLYCARBONATE, 5 TO 95 PARTS BY WEIGHT OF A STYRENE-BASED RESIN, AND A MELT KNEADED RESIN COMPOSITION COMPRISING A POLYPHENYLENE ETHER AND A SATURATED POLYESTER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2001-01-23 US disclosed
JP-2000053829-A THERMOPLASTIC RESIN COMPOSITION MITSUBISHI ENGINEERING PLASTICS CORP 2000-02-22 JP disclosed