⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methylamine SCHEMBL16192060 | 0.92 | — | — | |
| Ethylamine SCHEMBL2045935 | 0.83 | ALDH1A1 (0.38) | — | |
| SCHEMBL3420491 | 0.80 | ALDH1A1 (0.32) | — | |
| Diethylamine SCHEMBL16109427 | 0.78 | TP53 (0.44) | — | |
| Propylamine SCHEMBL56587 | 0.78 | ALDH1A1 (0.35) | — | |
| SCHEMBL7934193 | 0.76 | — | — | |
| SCHEMBL3888380 | 0.67 | ALDH1A1 (0.40) | — | |
| SCHEMBL5412519 | 0.67 | ALDH1A1 (0.40) | — | |
| SCHEMBL14895494 | 0.67 | ALDH1A1 (0.40) | — | |
| SCHEMBL3988458 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 224 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | claimed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | claimed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| CN-118598908-A | Cyclopropane skeleton biphosphine ligand, cobalt complex thereof, preparation method and application | 南开大学 | 2024-09-06 | — | — | CN | claimed |
| CN-114213648-B | Hydrolyzable polymer and epoxy resin heat conducting material composition containing same | 安徽壹石通材料科学研究院有限公司 | 2023-06-20 | — | — | CN | claimed |
| EP-3956415-A1 | ADHESIVE SEALANT COMPOSITION | ESSVE Produkter AB (SE) | 2022-02-23 | — | — | EP | claimed |
| WO-2020214079-A1 | ADHESIVE SEALANT COMPOSITION | ESSVE PRODUKTER AB (SE) | 2020-10-22 | — | — | WO | claimed |
| EP-2435502-B1 | CURABLE SILYL-GROUP CONTAINING COMPOSITIONS AND ITS USE | EVONIK DEGUSSA GMBH (DE) | 2016-10-19 | — | — | EP | claimed |
| US-8974627-B2 | Curable compositions containing silyl groups, and use thereof | EVONIK DEGUSSA GMBH (DE) | 2015-03-10 | — | — | US | claimed |
| US-8298965-B2 | Volatile precursors for deposition of C-linked SiCOH dielectrics | AMERICAN AIR LIQUIDE, INC. (US) | 2012-10-30 | — | — | US | claimed |
| US-20120067520-A1 | Curable Compositions Containing Silyl Groups, And Use Thereof | EVONIK GOLDSCHMIDT GMBH (DE) | 2012-03-22 | — | — | US | claimed |
| US-20100052115-A1 | Volatile Precursors for Deposition of C-Linked SiCOH Dielectrics | AMERICAN AIR LIQUIDE, INC. (US) | 2010-03-04 | — | — | US | claimed |
| WO-2026105502-A1 | COMPOSITE METAL CYANIDE COMPLEX CATALYST POWDER, METHOD FOR PRODUCING POLYETHER COMPOUND, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING REACTIVE SILICON GROUP, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING URETHANE BOND, AND METHOD FOR PRODUCING POLYETHER COMPOUND HAVING POLYMERIZABLE UNSATURATED GROUP | ＡＧＣ株式会社 | 2026-05-21 | — | — | WO | disclosed |
| EP-4737503-A1 | METHOD FOR PRODUCING POLYETHER COMPOUND, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING REACTIVE SILICON GROUP, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING URETHANE BOND, AND METHOD FOR PRODUCING POLYETHER COMPOUND HAVING POLYMERIZABLE UNSATURATED GROUP | AGC INC. (JP) | 2026-05-06 | — | — | EP | disclosed |
| EP-4737502-A1 | METHOD FOR PRODUCING POLYETHER COMPOUND, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING REACTIVE SILICON GROUP, METHOD FOR PRODUCING POLYETHER COMPOUND HAVING URETHANE BOND, AND METHOD FOR PRODUCING POLYETHER COMPOUND HAVING POLYMERIZABLE UNSATURATED GROUP | AGC INC. (JP) | 2026-05-06 | — | — | EP | disclosed |
| WO-1994007948-A1 | SURFACE-MODIFIED OXIDE PARTICLES AND THEIR USE AS FILLERS AND MODIFIERS IN POLYMER MATERIALS | MERCK Patent Gesellschaft mit beschränkter Haftung (DE) | 1994-04-14 | — | — | WO | disclosed |
| WO-1994007945-A1 | MOLDED BODIES MADE OF POLYESTER COTAINING COVALENT-BONDED OXIDE PARTICLES | HOECHST AKTIENGESELLSCHAFT (DE) | 1994-04-14 | — | — | WO | disclosed |
| EP-0579102-A1 | Liquid chromatography stationary phases with reduced silanol interactions | WATERS INVESTMENTS LIMITED (US) | 1994-01-19 | — | — | EP | disclosed |