⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL767438 | 0.76 | — | — | |
| SCHEMBL3888380 | 0.70 | ALDH1A1 (0.40) | — | |
| Methylamine SCHEMBL16192060 | 0.70 | — | — | |
| SCHEMBL14895494 | 0.70 | ALDH1A1 (0.40) | — | |
| SCHEMBL5412519 | 0.70 | ALDH1A1 (0.40) | — | |
| SCHEMBL3988458 | 0.70 | — | — | |
| SCHEMBL115919 | 0.70 | — | — | |
| SCHEMBL8415492 | 0.68 | ALDH1A1 (0.38) | — | |
| SCHEMBL503396 | 0.67 | — | — | |
| SCHEMBL8679785 | 0.67 | ALDH1A1 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | claimed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | claimed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| WO-2025038375-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND INCREASED DENSITY | APPLIED MATERIALS, INC. (US) | 2025-02-20 | — | — | WO | claimed |
| WO-2024238097-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH INCREASED ETCH SELECTIVITY | APPLIED MATERIALS, INC. (US) | 2024-11-21 | — | — | WO | claimed |
| WO-2024226342-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS | APPLIED MATERIALS, INC. (US) | 2024-10-31 | — | — | WO | claimed |
| US-20260018409-A1 | POST TREATMENT PROCESSES | APPLIED MATERIALS INC (US) | 2026-01-15 | — | — | US | disclosed |
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | disclosed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | disclosed |
| US-20250369102-A1 | LOWER K AND HIGHER HARDNESS WITH IMPROVED PLASMA INDUCED DAMAGE (PID) DIELECTRIC FILM DEPOSITION | APPLIED MATERIALS INC (US) | 2025-12-04 | — | — | US | disclosed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | disclosed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | disclosed |
| WO-2024044459-A1 | ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS | APPLIED MATERIALS, INC. (US) | 2024-02-29 | — | — | WO | disclosed |
| US-20240071817-A1 | ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS | APPLIED MATERIALS, INC. (US) | 2024-02-29 | — | — | US | disclosed |
| US-6232261-B1 | REACTION PRODUCT OF AN ALUMINOXANE OR PRODUCT OF AN ALKYLALUMINUM AND WATER WITH A SILICON-CONTAINING COMPOUND, FOR EXAMPLE DIPHENYLSILANE DIOL; OLEFIN POLYMERIZATION CATALYST, ESPECIALLY A METALLOCENE COMPLEX | BP CHEMICALS LIMITED (GB) | 2001-05-15 | — | — | US | disclosed |
| JP-2000019744-A | RELEASE AGENT COMPOSITION | KAO CORP | 2000-01-21 | — | — | JP | disclosed |
| EP-0952991-A1 | CATALYST ACTIVATORS | BP Chemicals Limited (GB) | 1999-11-03 | — | — | EP | disclosed |
| WO-1998031715-A1 | CATALYST ACTIVATORS | BP CHEMICALS LIMITED (GB) | 1998-07-23 | — | — | WO | disclosed |