SCHEMBL7708095

SCHEMBL7708095

Cc1cc(C)c(CO)c(C)c1CO

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
PGK1 P00558 2/20 0.50
PGK2 P07205 2/20 0.50
SLC11A2 P49281 1/20 0.45
HPGD P15428 2/20 0.34
HSD17B10 Q99714 2/20 0.34
SHBG P04278 1/20 0.33
KDM4E B2RXH2 1/20 0.32
ALDH1A1 P00352 1/20 0.32
GABRA1 P14867 1/20 0.32
GABRG2 P18507 1/20 0.32
GABRB3 P28472 1/20 0.32
HTR1D P28221 2/20 0.31
HTR1B P28222 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL360246 0.89 PGK1 (0.41) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL28585139 0.85 SHBG (0.42) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL357122 0.82 PGK1 (0.39) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL6441200 0.80 SHBG (0.41) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL5377507 0.79 ACHE (0.40) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL4008341 0.78 PGK1 (0.46) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL28381145 0.78 PGK1 (0.38) PGK1PGK2SLC11A2KDM4E
SCHEMBL8625037 0.78 HPGD (0.41) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL27621943 0.78 SLC11A2 (0.38) PGK1PGK2SLC11A2HPGDHSD17B10
SCHEMBL25949715 0.78 PGK1 (0.33) PGK1PGK2SLC11A2HPGDALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025094673-A1 VINYL COMPOUND, VINYL COMPOSITION, VINYL RESIN CURED PRODUCT, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD 住友化学株式会社 2025-05-08 WO disclosed
US-10042258-B2 Composition for forming a resist upper-layer film and method for producing a semiconductor device using the composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-08-07 US disclosed
US-10042258-B2 Composition for forming a resist upper-layer film and method for producing a semiconductor device using the composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-08-07 US disclosed
US-9804492-B2 Method for forming multi-layer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-31 US disclosed
US-20170293227-A1 COATING LIQUID FOR RESIST PATTERN COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-12 US disclosed
US-20170293227-A1 COATING LIQUID FOR RESIST PATTERN COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-10-12 US disclosed
US-9785049-B2 Method for forming multi-layer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-10 US disclosed
US-9746768-B2 Resist overlayer film forming composition for lithography and method for producing semiconductor device using the same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-08-29 US disclosed
US-9746768-B2 Resist overlayer film forming composition for lithography and method for producing semiconductor device using the same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-08-29 US disclosed
US-20170205711-A1 COMPOSITION FOR FORMING A RESIST UPPER-LAYER FILM AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-07-20 US disclosed
US-20150073063-A1 ANION-CONDUCTING POLYMER SIMON FRASER UNIVERSITY (CA) 2015-03-12 US disclosed
WO-2013149328-A1 ANION-CONDUCTING POLYMER SIMON FRASER UNIVERSITY (CA) 2013-10-10 WO disclosed
US-6355826-B1 HALOMETHYLATION AN AROMATIC ALDEHYDE COMPOUND AND SALT FORMATION THE GOODYEAR TIRE & RUBBER COMPANY 2002-03-12 US disclosed
EP-0903338-A2 Synthesis of stable nitrile oxide compounds THE GOODYEAR TIRE & RUBBER COMPANY (US) 1999-03-24 EP disclosed
US-5122442-A Water soluble binder; photosensitive compound HOECHST CELANESE CORPORATION (US) 1992-06-16 US disclosed
EP-0212482-B1 PROCESS FOR OBTAINING NEGATIVE IMAGES FROM POSITIVE PHOTORESISTS HOECHST CELANESE CORPORATION (US) 1989-04-19 EP disclosed
EP-0212482-A2 Process for obtaining negative images from positive photoresists HOECHST CELANESE CORPORATION (US) 1987-03-04 EP disclosed
EP-0061150-B1 LIGHT-SENSITIVE POLYCONDENSATION PRODUCT, PROCESS FOR ITS PREPARATION AND LIGHT-SENSITIVE RECORDING MATERIAL CONTAINING THE SAME AMERICAN HOECHST CORPORATION (US) 1986-10-15 EP disclosed
US-4436804-A Light-sensitive polymeric diazonium condensates and reproduction compositions and materials therewith AMERICAN HOECHST CORPORATION (US) 1984-03-13 US disclosed
EP-0061150-A1 Light-sensitive polycondensation product, process for its preparation and light-sensitive recording material containing the same AMERICAN HOECHST CORPORATION (US) 1982-09-29 EP disclosed