SCHEMBL7716207

SCHEMBL7716207

Nc1c(Oc2cccc(C(=O)O)c2N)cccc1C(=O)O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
G6PD P11413 1/20 0.59
CASP7 P55210 1/20 0.59
CASP6 P55212 1/20 0.59
HTT P42858 2/20 0.52
MMP2 P08253 1/20 0.48
ALDH1A1 P00352 6/20 0.46
ALOX15 P16050 1/20 0.46
KDM4E B2RXH2 7/20 0.46
MAPK1 P28482 1/20 0.46
HSD17B10 Q99714 6/20 0.46
HPGD P15428 5/20 0.46
NAPRT Q6XQN6 2/20 0.46
TSHR P16473 2/20 0.46
ESR1 P03372 1/20 0.46
ITGB3 P05106 1/20 0.46
ITGA2B P08514 1/20 0.46
HMGB1 P09429 1/20 0.46
GGT1 P19440 1/20 0.46
PTGS1 P23219 1/20 0.46
PTGS2 P35354 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30314458 1.00 G6PD (0.59) G6PDCASP7CASP6HTTMMP2
SCHEMBL6734538 0.91 G6PD (0.50) G6PDCASP7CASP6HTTMMP2
SCHEMBL1464916 0.89 CTNNB1 (0.61) G6PDCASP7CASP6HTTALDH1A1
SCHEMBL27783392 0.85 LMNA (0.51) G6PDCASP7CASP6HTTALDH1A1
SCHEMBL17966261 0.84 CTNNB1 (0.47) G6PDCASP7CASP6ALDH1A1KDM4E
SCHEMBL30852229 0.84 G6PD (0.60) G6PDCASP7CASP6HTTMMP2
SCHEMBL148830 0.84 G6PD (0.60) G6PDCASP7CASP6HTTMMP2
SCHEMBL6310272 0.83 HTT (0.57) G6PDCASP7CASP6HTTALDH1A1
SCHEMBL3014879 0.83 HTT (0.57) G6PDCASP7CASP6HTTMMP2
SCHEMBL12217892 0.82 G6PD (0.62) G6PDCASP7CASP6HTTMMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118126325-A Low-temperature-cured alkali-soluble photosensitive resin and preparation method thereof 深圳先进电子材料国际创新研究院 2024-06-04 CN claimed
CN-115960352-B Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition 深圳市道尔顿电子材料股份有限公司 2024-07-05 CN disclosed
CN-118126325-A Low-temperature-cured alkali-soluble photosensitive resin and preparation method thereof 深圳先进电子材料国际创新研究院 2024-06-04 CN disclosed
CN-115960352-A Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition 深圳市道尔顿电子材料有限公司 2023-04-14 CN disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed