SCHEMBL7719962

SCHEMBL7719962

CCCCC(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.32

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CES2 O00748 3/20 0.32
LPAR1 Q92633 1/20 0.32
LPAR3 Q9UBY5 1/20 0.32
TSHR P16473 2/20 0.32
LMNA P02545 1/20 0.32
FAAH O00519 8/20 0.31
CES1 P23141 6/20 0.30
THRB P10828 1/20 0.30
MEN1 O00255 1/20 0.30
CYP1A2 P05177 1/20 0.30
KMT2A Q03164 1/20 0.30
HSD17B10 Q99714 1/20 0.30
FDPS P14324 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6513513 0.92 CES2 (0.31) CES2LPAR1LPAR3TSHRLMNA
SCHEMBL14879730 0.92 CES2 (0.40) CES2LPAR1LPAR3TSHRFAAH
SCHEMBL17549734 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL1703747 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL1703745 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL13354524 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL2483152 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL17549723 0.90 LMNA (0.32) CES2LPAR1LPAR3LMNA
SCHEMBL8593542 0.90 CES2 (0.39) CES2LPAR1LPAR3TSHRFAAH
SCHEMBL30182847 0.90 CES2 (0.43) CES2LPAR1LPAR3TSHRFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023013697-A1 MATERIAL FOR METAL PATTERNING, FLUORO COMPOUND, THIN FILM FOR METAL PATTERNING, ORGANIC ELECTROLUMINESCENCE DEVICE, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN 東ソー株式会社 2023-02-09 WO disclosed
US-10392699-B2 Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device JSR CORPORATION (JP) 2019-08-27 US disclosed
US-10032920-B2 Thin film transistor and MOS field effect transistor that include hydrophilic/hydrophobic material, and methods for manufacturing the same JSR CORPORATION (JP) 2018-07-24 US disclosed
US-10032920-B2 Thin film transistor and MOS field effect transistor that include hydrophilic/hydrophobic material, and methods for manufacturing the same JSR CORPORATION (JP) 2018-07-24 US disclosed
US-9980392-B2 Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device JSR CORPORATION (JP) 2018-05-22 US disclosed
US-9980392-B2 Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device JSR CORPORATION (JP) 2018-05-22 US disclosed
US-20170306481-A1 METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2017-10-26 US disclosed
US-20170306481-A1 METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2017-10-26 US disclosed
US-9746775-B2 Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device JSR CORPORATION (JP) 2017-08-29 US disclosed
US-9746775-B2 Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device JSR CORPORATION (JP) 2017-08-29 US disclosed
US-20170243980-A1 THIN FILM TRANSISTOR AND MOS FIELD EFFECT TRANSISTOR THAT INCLUDE HYDROPHILIC/HYDROPHOBIC MATERIAL, AND METHODS FOR MANUFACTURING THE SAME JSR CORPORATION (JP) 2017-08-24 US disclosed
US-20170243980-A1 THIN FILM TRANSISTOR AND MOS FIELD EFFECT TRANSISTOR THAT INCLUDE HYDROPHILIC/HYDROPHOBIC MATERIAL, AND METHODS FOR MANUFACTURING THE SAME JSR CORPORATION (JP) 2017-08-24 US disclosed
US-20170042038-A1 PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2017-02-09 US disclosed
US-20170042038-A1 PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2017-02-09 US disclosed
US-20160062242-A1 METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-03 US disclosed
US-20160062242-A1 METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-03 US disclosed
US-6383669-B1 COMPRISING ZIRCONIUM COMPLEXES WITH A BETA-DIKETONATE AND ALKANOL GROUPS; ELECTRO-CERAMIC DEVICES THEREFROM; USE IN FERRO-ELECTRIC MEMORIES AND INFRA-RED DETECTORS; ZIRCONIUM DIISOPROPOXY BIS(TETRAMETHYLHEPTANEDIOATE) FOR EXAMPLE THE SECRETARY OF STATE FOR DEFENCE IN HER BRITANNIC MAJESTY'S GOVERNMENT OF THE UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND (GB) 2002-05-07 US disclosed
EP-0606252-A1 FINE-CELLED PLASTIC FOAM CONTAINING HALOGENATED BLOWING AGENT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-07-20 EP disclosed
US-5211873-A Insulation MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-05-18 US disclosed
WO-1993007201-A2 FINE-CELLED PLASTIC FOAM CONTAINING HALOGENATED BLOWING AGENT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-04-15 WO disclosed