SCHEMBL7758865

SCHEMBL7758865

C=C(C)CC[Si](C)(C)OC(C)=O

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL704202 0.81 ALDH1A1 (0.35) HSD17B10
SCHEMBL705061 0.77 KDM4E (0.35) HSD17B10
SCHEMBL712067 0.77 KDM4E (0.35) HSD17B10
SCHEMBL435046 0.75 ALDH1A1 (0.36) HSD17B10TDP1
SCHEMBL13089503 0.75 ALDH1A1 (0.31) HSD17B10
SCHEMBL13151034 0.74 ALDH1A1 (0.43) HSD17B10
SCHEMBL11671028 0.73
SCHEMBL12898581 0.73
SCHEMBL12898569 0.73
SCHEMBL3475766 0.72 RECQL (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP disclosed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US disclosed