SCHEMBL7769006

SCHEMBL7769006

CN[CH]CCNC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6165674 0.73
SCHEMBL5000489 0.69
SCHEMBL165814 0.69
SCHEMBL5801246 0.68 ADH1B (0.42)
Bromide SCHEMBL7227618 0.67 CHRNB2 (0.33)
Bromide SCHEMBL7227613 0.67 CHRNB2 (0.33)
SCHEMBL5692048 0.67
SCHEMBL9019513 0.67
SCHEMBL566259 0.67
SCHEMBL360449 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105758970-B A kind of method of gas chromatography detection 3- methylamino -1,2- propane diols purities 泰山医学院 2018-05-15 CN disclosed
CN-102977132-B Metal-organic preparation 陶氏环球技术有限公司 2016-12-21 CN disclosed
EP-2559682-B1 Organometallic compound preparation ROHM & HAAS ELECT MAT (US) 2016-08-03 EP disclosed
US-9403145-B2 Organometallic compound preparation DOW GLOBAL TECHNOLOGIES LLC (US) 2016-08-02 US disclosed
EP-2559681-B1 Organometallic compound preparation DOW GLOBAL TECHNOLOGIES LLC (US) 2016-06-22 EP disclosed
CN-103254248-B Metal-organic preparation ROHM AND HAAS ELECTRONIC MATERIALS CO., LTD. (US) 2016-05-25 CN disclosed
US-20150174552-A1 ORGANOMETALLIC COMPOUND PREPARATION ROHM AND HAAS ELECTRONIC MATERIALS LLC 2015-06-25 US disclosed
US-9006475-B2 Organometallic compound preparation ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2015-04-14 US disclosed
US-8969608-B2 Organometallic compound preparation DOW GLOBAL TECHNOLOGIES LLC (US) 2015-03-03 US disclosed
US-20130211117-A1 ORGANOMETALLIC COMPOUND PREPARATION DOW GLOBAL TECHNOLOGIES LLC (US) 2013-08-15 US disclosed
US-20130211118-A1 ORGANOMETALLIC COMPOUND PREPARATION ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2013-08-15 US disclosed
EP-2559682-A2 Organometallic compound preparation Rohm and Haas Electronic Materials LLC (US) 2013-02-20 EP disclosed
EP-2559681-A2 Organometallic compound preparation Dow Global Technologies LLC (US) 2013-02-20 EP disclosed
EP-1106661-A2 Coating composition and hardened film obtained therefrom JSR Corporation (JP) 2001-06-13 EP disclosed