SCHEMBL783687

SCHEMBL783687

CCCCCCCCCc1nc2ccc([N+](=O)[O-])cc2[nH]1

nearest known ligand 0.81

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.81
KCNJ1 P48048 2/20 0.80
LMNA P02545 2/20 0.80
MAPT P10636 2/20 0.80
ALDH1A1 P00352 2/20 0.80
PKM P14618 1/20 0.73
RIPK1 Q13546 3/20 0.61
CCNT1 O60563 1/20 0.61
CDK9 P50750 1/20 0.61
NPBWR1 P48145 1/20 0.57
HPGD P15428 2/20 0.57
POLB P06746 1/20 0.57
RAB9A P51151 1/20 0.57
SMN1; SMN2 Q16637 1/20 0.57
PTGS2 P35354 1/20 0.56
TDP1 Q9NUW8 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9720952 1.00 KDM4E (0.81) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9721028 1.00 KDM4E (0.81) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL1250581 0.99 KDM4E (0.82) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL7608611 0.95 KDM4E (0.85) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL7033535 0.93 MAPT (0.91) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9720944 0.90 KDM4E (0.64) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL783686 0.90 KDM4E (0.64) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9721024 0.90 KDM4E (0.64) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL8601357 0.89 KDM4E (1.00) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9642133 0.89 MAPT (1.00) KDM4EKCNJ1LMNAMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US claimed
US-9226406-B2 Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2015-12-29 US disclosed
US-8766437-B2 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2014-07-01 US disclosed
CN-102246607-B Electrode connection structure, conductive adhesive for electrode connection structure, and electronic device SUMITOMO ELECTRIC INDUSTRIES 2014-05-07 CN disclosed
EP-2440024-B1 CONNECTION METHOD SUMITOMO ELECTRIC INDUSTRIES (JP) 2014-03-12 EP disclosed
EP-2445322-B1 Connection method SUMITOMO ELECTRIC INDUSTRIES (JP) 2013-07-10 EP disclosed
US-8470438-B2 Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2013-06-25 US disclosed
EP-2453726-A1 Connection method, connection structure, and electronic device Sumitomo Electric Industries, Ltd. (JP) 2012-05-16 EP disclosed
CN-102461349-A Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device SUMITOMO ELECTRIC INDUSTRIES 2012-05-16 CN disclosed
CN-102450112-A Connection method, connection structure, and electronic device SUMITOMO ELECTRIC INDUSTRIES 2012-05-09 CN disclosed
EP-2445323-A1 ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE Sumitomo Electric Industries, Ltd. (JP) 2012-04-25 EP disclosed
US-20120085580-A1 ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2012-04-12 US disclosed
US-20120067619-A1 CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2012-03-22 US disclosed
CN-102246607-A Electrode connection structure, conductive adhesive for electrode connection structure, and electronic device SUMITOMO ELECTRIC INDUSTRIES 2011-11-16 CN disclosed
US-20110250395-A1 ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2011-10-13 US disclosed
CN-102132636-A Electrode structure, wiring body, adhesive connection structure, electronic device and assembling method thereof SUMITOMO ELECTRIC INDUSTRIES 2011-07-20 CN disclosed
US-20110147048-A1 ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) 2011-06-23 US disclosed
CN-1287025-A Coating method for resin type protection composition, glue spreader using the same method and the same composition MICO CO LTD (JP) 2001-03-14 CN disclosed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed