SCHEMBL9720944

SCHEMBL9720944

CCCCCCCc1nc2cc([N+](=O)[O-])ccc2[nH]1

nearest known ligand 0.64

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.64
KCNJ1 P48048 2/20 0.64
LMNA P02545 2/20 0.64
MAPT P10636 2/20 0.64
ALDH1A1 P00352 1/20 0.64
PKM P14618 1/20 0.58
KCNH2 Q12809 1/20 0.50
RIPK1 Q13546 2/20 0.49
CCNT1 O60563 1/20 0.49
CDK9 P50750 1/20 0.49
PTGS2 P35354 1/20 0.47
HPGD P15428 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL783686 1.00 KDM4E (0.64) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9721024 1.00 KDM4E (0.64) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL7608604 0.95 KDM4E (0.67) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL7033532 0.93 MAPT (0.72) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL783687 0.90 KDM4E (0.81) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9720952 0.90 KDM4E (0.81) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9721028 0.90 KDM4E (0.81) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL8601352 0.89 KDM4E (0.80) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL9642123 0.89 MAPT (0.78) KDM4EKCNJ1LMNAMAPTALDH1A1
SCHEMBL1250581 0.88 KDM4E (0.82) KDM4EKCNJ1LMNAMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120152182-A Environment-friendly copper protection treatment process for surfaces of multilayer boards 深圳市大正瑞地科技有限公司 2025-06-13 CN claimed
CN-105671538-A Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) 滁州嘉泰科技有限公司 2016-06-15 CN claimed
CN-120152182-A Environment-friendly copper protection treatment process for surfaces of multilayer boards 深圳市大正瑞地科技有限公司 2025-06-13 CN disclosed
CN-105671538-A Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) 滁州嘉泰科技有限公司 2016-06-15 CN disclosed
CN-105671538-A Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) 滁州嘉泰科技有限公司 2016-06-15 CN disclosed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed