SCHEMBL784729

SCHEMBL784729

Cc1nc(-c2ccccc2)[nH]c1Cc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTB4R Q15722 1/20 0.46
POLB P06746 3/20 0.46
KDM4E B2RXH2 2/20 0.46
HSD17B10 Q99714 2/20 0.46
ALDH1A1 P00352 1/20 0.46
HTT P42858 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
GAA P10253 3/20 0.45
NR1H2 P55055 1/20 0.45
NR1H3 Q13133 1/20 0.45
MAPT P10636 1/20 0.45
HPGDS O60760 2/20 0.44
PIN1 Q13526 1/20 0.44
CSF1R P07333 2/20 0.43
USP2 O75604 1/20 0.43
TSHR P16473 1/20 0.43
MAPK1 P28482 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.42
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8075160 0.91 KDM4E (0.49) POLBKDM4EHSD17B10ALDH1A1SMN1; SMN2
SCHEMBL16412171 0.86 KDM4E (0.42) LTB4RPOLBKDM4EHSD17B10ALDH1A1
SCHEMBL33678 0.84 KDM4E (0.50) POLBKDM4EHSD17B10ALDH1A1SMN1; SMN2
SCHEMBL10727938 0.84 LTB4R (0.61) LTB4RPOLBKDM4EHSD17B10ALDH1A1
SCHEMBL29000682 0.82 MAPK14 (0.47) LTB4RPOLBALDH1A1GAANPC1
SCHEMBL28104155 0.82 KDM4E (0.49) POLBKDM4EHSD17B10ALDH1A1SMN1; SMN2
SCHEMBL29101857 0.82 KDM4E (0.46) POLBKDM4EHSD17B10ALDH1A1SMN1; SMN2
SCHEMBL16848277 0.79 KDM4E (0.47) POLBKDM4EHSD17B10GAAMAPT
Mefenidil SCHEMBL122152 0.78 KDM4E (0.43) POLBKDM4EHSD17B10ALDH1A1HTT
Ethylenediamine SCHEMBL28169136 0.78 KDM4E (0.46) POLBKDM4EHSD17B10ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-62032113-A None JP disclosed
JP-10251867-A None JP disclosed
CN-116810216-A Water-soluble pre-flux and surface treatment method 株式会社田村制作所 2023-09-29 CN disclosed
EP-1886759-B1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEM (JP) 2016-10-05 EP disclosed
US-9226406-B2 Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2015-12-29 US disclosed
US-8766437-B2 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2014-07-01 US disclosed
CN-102246607-B Electrode connection structure, conductive adhesive for electrode connection structure, and electronic device SUMITOMO ELECTRIC INDUSTRIES 2014-05-07 CN disclosed
EP-2440024-B1 CONNECTION METHOD SUMITOMO ELECTRIC INDUSTRIES (JP) 2014-03-12 EP disclosed
EP-2445322-B1 Connection method SUMITOMO ELECTRIC INDUSTRIES (JP) 2013-07-10 EP disclosed
US-8470438-B2 Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2013-06-25 US disclosed
US-7754105-B2 Water-soluble preflux and usage of the same SHIKOKU CHEMICALS CORPORATION (JP) 2010-07-13 US disclosed
CN-101228000-B Water-soluble preflux and use thereof SHIKOKU CHEM 2010-06-09 CN disclosed
US-20080318070-A1 Water-Soluble Preflux and Usage of the Same SHIKOKU CHEMICALS CORPORATION (JP) 2008-12-25 US disclosed
CN-101228000-A Water-soluble preflux and use thereof SHIKOKU CHEM (JP) 2008-07-23 CN disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed
EP-0791671-B1 Surface treating agent for copper or copper alloy SHIKOKU CHEM (JP) 1999-06-16 EP disclosed
JP-H10251867-A SURFACE TREATING AGENT FOR COPPER AND COPPER ALLOY SHIKOKU CHEM CORP 1998-09-22 JP disclosed
US-5795409-A MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON SHIKOKU CHEMICALS CORPORATION (JP) 1998-08-18 US disclosed
EP-0791671-A1 Surface treating agent for copper or copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1997-08-27 EP disclosed
JP-S6232113-A CURING OF POLYEPOXY RESIN SHIKOKU CHEM CORP 1987-02-12 JP disclosed