SCHEMBL7863713

SCHEMBL7863713

CCCO[Si](OCC)(OCC)c1ccccc1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
LTA4H P09960 3/20 0.33
ALDH1A1 P00352 2/20 0.33
HPGD P15428 1/20 0.33
ADORA3 P0DMS8 2/20 0.32
GAA P10253 1/20 0.31
GABRP O00591 1/20 0.31
GABRD O14764 1/20 0.31
GABRA1 P14867 1/20 0.31
GABRB1 P18505 1/20 0.31
GABRG2 P18507 1/20 0.31
GABRB3 P28472 1/20 0.31
GABRA5 P31644 1/20 0.31
GABRA3 P34903 1/20 0.31
GABRA2 P47869 1/20 0.31
GABRB2 P47870 1/20 0.31
GABRA4 P48169 1/20 0.31
GABRE P78334 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27975354 1.00 LMNA (0.36) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL105659 0.94 LMNA (0.39) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL3295425 0.91 LMNA (0.33) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL23828171 0.91 LMNA (0.33) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL29900 0.89 LTA4H (0.37) MEN1KMT2ALTA4HALDH1A1HPGD
SCHEMBL28330766 0.89 LMNA (0.33) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL3713762 0.89 LTA4H (0.43) LMNAMEN1KMT2ALTA4HALDH1A1
SCHEMBL8415484 0.87 LTA4H (0.35) MEN1KMT2ALTA4HALDH1A1HPGD
SCHEMBL10495731 0.87 LTA4H (0.35) MEN1KMT2ALTA4HALDH1A1HPGD
Ammonia Solution, Strong SCHEMBL28965973 0.87 LTA4H (0.35) MEN1KMT2ALTA4HALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119281802-B Method for treating waste incineration fly ash by plasma melting 东莞理工学院 2025-05-06 CN claimed
CN-119709110-A Rapidly-cured bi-component heat-conducting pouring sealant and preparation method thereof 广东长鹿新材料科技有限公司 2025-03-28 CN claimed
CN-119592295-A High-fluidity high-strength alcohol-type transparent coating adhesive and manufacturing method thereof 广东长鹿新材料科技有限公司 2025-03-11 CN claimed
CN-119281802-A Method for treating waste incineration fly ash by plasma melting 东莞理工学院 2025-01-10 CN claimed
CN-110204900-B Flame-retardant organopolysiloxane composition and preparation method thereof 广州慧谷化学有限公司 2021-09-03 CN claimed
CN-119281802-B Method for treating waste incineration fly ash by plasma melting 东莞理工学院 2025-05-06 CN disclosed
CN-119709110-A Rapidly-cured bi-component heat-conducting pouring sealant and preparation method thereof 广东长鹿新材料科技有限公司 2025-03-28 CN disclosed
CN-119592295-A High-fluidity high-strength alcohol-type transparent coating adhesive and manufacturing method thereof 广东长鹿新材料科技有限公司 2025-03-11 CN disclosed
CN-119281802-A Method for treating waste incineration fly ash by plasma melting 东莞理工学院 2025-01-10 CN disclosed
CN-117241501-A Method for manufacturing package substrate for mounting semiconductor element and method for manufacturing semiconductor element mounting substrate 三菱瓦斯化学株式会社 2023-12-15 CN disclosed
CN-110204900-B Flame-retardant organopolysiloxane composition and preparation method thereof 广州慧谷化学有限公司 2021-09-03 CN disclosed
CN-108026652-B Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board JX金属株式会社 2019-10-25 CN disclosed
CN-104619486-A Carrier-attached metal foil JX NIPPON MINING & METALS CORP 2015-05-13 CN disclosed
CN-104334345-A Carrier-attached metal foil JX NIPPON MINING & METALS CORP 2015-02-04 CN disclosed
CN-104334346-A Carrier-attached metal foil JX NIPPON MINING & METALS CORP 2015-02-04 CN disclosed
CN-104335688-A Method for producing multilayer printed wiring board JX NIPPON MINING & METALS CORP 2015-02-04 CN disclosed
US-8519422-B2 Encapsulating sheet and optical semiconductor element device NITTO DENKO CORPORATION (JP) 2013-08-27 US disclosed
US-20120319153-A1 ENCAPSULATING SHEET AND OPTICAL SEMICONDUCTOR ELEMENT DEVICE NITTO DENKO CORPORATION (JP) 2012-12-20 US disclosed
EP-2535955-A2 Encapsulating sheet and optical semiconductor element device NITTO DENKO CORPORATION (JP) 2012-12-19 EP disclosed
US-6299721-B1 CONTACTING FIRST SIDE OF METAL FOIL WITH SOLUTION COMPRISING HYDROCARBYLSILANE, WATER, ORGANIC SOLVENT AND TRIAZOLE COMPOUND TO FORM RESIN DUST RESISTANT FILM ON SURFACE OF METAL GOULD ELECTRONICS INCL 2001-10-09 US disclosed