SCHEMBL7872085

SCHEMBL7872085

ClN(Cl)c1ccccc1N(Cl)Cl

nearest known ligand 0.35

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.35
LMNA P02545 1/20 0.35
CYP2A6 P11509 2/20 0.31
ALOX12 P18054 1/20 0.31
ALDH1A1 P00352 1/20 0.31
TP53 P04637 1/20 0.31
GAA P10253 1/20 0.31
MAPT P10636 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
CYP1A2 P05177 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL174758 0.81 TSHR (0.50) TSHRLMNACYP2A6ALDH1A1SMN1; SMN2
SCHEMBL11206194 0.78 ALDH1A1 (0.38) TSHRALDH1A1GAACYP1A2
SCHEMBL7550030 0.78 CYP3A4 (0.47) TSHRALDH1A1GAAMAPTSMN1; SMN2
Hydrochloric Acid SCHEMBL10928987 0.78 TSHR (0.47) TSHRLMNACYP2A6ALDH1A1SMN1; SMN2
SCHEMBL28866576 0.78 ACHE (0.38) ALDH1A1GAACYP1A2
SCHEMBL3840747 0.78 TSHR (0.47) TSHRLMNACYP2A6ALDH1A1TP53
SCHEMBL1159441 0.78 ALDH1A1 (0.47) TSHRLMNAALDH1A1TP53MAPT
SCHEMBL3680658 0.76 HSPA5 (0.40)
Ethylene SCHEMBL15522512 0.76 TSHR (0.45) TSHRLMNACYP2A6ALDH1A1SMN1; SMN2
Ethane SCHEMBL15522515 0.76 TSHR (0.45) TSHRLMNACYP2A6ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111793193-A Solvent-free type 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof 黑龙江省科学院石油化学研究院 2020-10-20 CN claimed
CN-111793193-A Solvent-free type 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof 黑龙江省科学院石油化学研究院 2020-10-20 CN disclosed
CN-1950436-A Flame retardants CIBA SC HOLDING AG (CH) 2007-04-18 CN disclosed
CN-1152907-C Polyamideimide for optical communications and method for preparing the same 三星电子株式会社 2004-06-09 CN disclosed
CN-1138818-C Polyamideimide for optical communications and method for preparing the same 三星电子株式会社 2004-02-18 CN disclosed
CN-1137921-C Polyimide for optical communication, its preparation method and method for forming multilayer film by using one ���ǵ�����ʽ���� 2004-02-11 CN disclosed
US-6303743-B1 Polyimide for optical communications, method of preparing the same, and method of forming multiple polyimide film using the polyimide SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-10-16 US disclosed
US-6100371-A Polyimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-08-08 US disclosed
US-6077928-A Bis(dialkylmaleimide) derivative and polyetherimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-20 US disclosed
US-6031061-A Bis (triaklyltrimellitic anhydride) derivative and polyesterimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-02-29 US disclosed
US-6028159-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-02-22 US disclosed
US-6013759-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-01-11 US disclosed
CN-1226571-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO LTD (KR) 1999-08-25 CN disclosed
CN-1224030-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO LTD (KR) 1999-07-28 CN disclosed
US-3954790-A USED TO PRODUCE HEAT-STABLE, FLAME-RESISTANT POLYMERS CIBA-GEIGY CORPORATION (US) 1976-05-04 US disclosed