SCHEMBL7879517

SCHEMBL7879517

O=COC1=CC(=O)OC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6566935 0.75
SCHEMBL27906824 0.75
SCHEMBL2961774 0.71
SCHEMBL8905991 0.67 PTPRC (0.47)
SCHEMBL17221820 0.67 KMT2A (0.30)
SCHEMBL9754231 0.67 PTPRC (0.43)
SCHEMBL29899394 0.65 CES2 (0.47)
SCHEMBL9580654 0.65 POLB (0.36)
SCHEMBL2380747 0.64
SCHEMBL28425851 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1131846-A1 CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS Applied Materials, Inc. (US) 2001-09-12 EP claimed
US-6171945-B1 CVD nanoporous silica low dielectric constant films APPLIED MATERIALS, INC. 2001-01-09 US claimed
WO-2000024050-A1 CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS APPLIED MATERIALS, INC. (US) 2000-04-27 WO claimed
EP-1131846-A1 CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS Applied Materials, Inc. (US) 2001-09-12 EP disclosed
US-6171945-B1 CVD nanoporous silica low dielectric constant films APPLIED MATERIALS, INC. 2001-01-09 US disclosed
WO-2000024050-A1 CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS APPLIED MATERIALS, INC. (US) 2000-04-27 WO disclosed