SCHEMBL7908591

SCHEMBL7908591

Nc1cc(N)cc(C(=O)OCCOC(=O)c2ccccc2)c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.61
NPC1 O15118 1/20 0.61
RAB9A P51151 1/20 0.61
LMNA P02545 2/20 0.58
ALDH1A1 P00352 2/20 0.53
L3MBTL1 Q9Y468 2/20 0.51
MAPK1 P28482 1/20 0.50
HIF1A Q16665 1/20 0.50
SLC6A2 P23975 1/20 0.50
SLC6A3 Q01959 1/20 0.50
KMT2A Q03164 1/20 0.50
ESR1 P03372 1/20 0.50
ESR2 Q92731 1/20 0.50
SMN1; SMN2 Q16637 2/20 0.49
KDM4E B2RXH2 1/20 0.47
GAA P10253 1/20 0.47
CYP1A2 P05177 1/20 0.47
CYP3A4 P08684 1/20 0.47
CYP2C9 P11712 1/20 0.47
TSHR P16473 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL137486 0.84 TDP1 (0.83) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL8066993 0.83 LMNA (0.50) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL547137 0.82 TDP1 (0.79) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL16217656 0.82 TDP1 (0.79) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL13292516 0.82 TDP1 (0.79) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL28286830 0.82 TDP1 (0.79) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL1802562 0.81 ADRB2 (0.55) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL4570319 0.81 TDP1 (0.70) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL7650928 0.81 SERPINE1 (0.55) TDP1NPC1RAB9ALMNAALDH1A1
SCHEMBL12642454 0.81 KMT2A (0.68) TDP1NPC1RAB9ALMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210355279-A1 Polyimides FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-11-18 US disclosed
US-20200262978-A1 Polyimides FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2020-08-20 US disclosed
US-6200831-B1 HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE HITACHI, LTD. (JP) 2001-03-13 US disclosed
US-6087006-A SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS HITACHI, LTD. (JP) 2000-07-11 US disclosed