SCHEMBL7908625

SCHEMBL7908625

CCN(CC)CCCOC(=O)C=Cc1ccccc1

nearest known ligand 0.64

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
BCHE P06276 8/20 0.64
ACHE P22303 7/20 0.64
ALDH1A1 P00352 2/20 0.59
AKR1B10 O60218 3/20 0.57
AKR1B1 P15121 3/20 0.57
SMN1; SMN2 Q16637 2/20 0.55
KDM4E B2RXH2 1/20 0.55
HPGD P15428 1/20 0.55
LMNA P02545 2/20 0.54
CHRM2 P08172 1/20 0.52
CHRM4 P08173 1/20 0.52
CHRM1 P11229 1/20 0.52
CHRM3 P20309 1/20 0.52
SCN1A P35498 1/20 0.52
SCN2A Q99250 1/20 0.52
SCN3A Q9NY46 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7908622 1.00 BCHE (0.64) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7915320 0.96 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7915317 0.96 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7915266 0.95 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7916461 0.95 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7916463 0.95 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7915261 0.95 BCHE (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7908387 0.92 ALDH1A1 (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL7908382 0.92 ALDH1A1 (0.65) BCHEACHEALDH1A1AKR1B10AKR1B1
SCHEMBL4018802 0.86 LMNA (0.71) BCHEACHEALDH1A1AKR1B10AKR1B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6200831-B1 HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE HITACHI, LTD. (JP) 2001-03-13 US disclosed
US-6087006-A SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS HITACHI, LTD. (JP) 2000-07-11 US disclosed