SCHEMBL7924153

SCHEMBL7924153

O=C1C=CC(=O)N1c1ccc(OCC2CO2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.54
PKM P14618 4/20 0.54
LMNA P02545 2/20 0.54
GAA P10253 1/20 0.54
TDP1 Q9NUW8 2/20 0.53
TP53 P04637 3/20 0.50
TSHR P16473 3/20 0.50
HPGD P15428 3/20 0.50
MEN1 O00255 3/20 0.50
KMT2A Q03164 3/20 0.50
MAPT P10636 2/20 0.50
HIF1A Q16665 2/20 0.50
CYP1A2 P05177 1/20 0.50
PPARG P37231 1/20 0.50
MGLL Q99685 11/20 0.49
CYP3A4 P08684 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
FAAH O00519 4/20 0.47
HSP90AA1 P07900 2/20 0.45
HTT P42858 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10014024 0.82 MGLL (0.45) ALDH1A1PKMLMNAGAATDP1
SCHEMBL10339679 0.81 ALDH1A1 (0.57) ALDH1A1PKMLMNAGAATDP1
SCHEMBL21094081 0.79 TDP1 (0.79) ALDH1A1PKMLMNAGAATDP1
SCHEMBL20677146 0.79 TDP1 (0.79) ALDH1A1PKMLMNAGAATDP1
SCHEMBL50264 0.79 TDP1 (0.79) ALDH1A1PKMLMNAGAATDP1
SCHEMBL31596209 0.79 MGLL (0.49) ALDH1A1PKMLMNATDP1HPGD
SCHEMBL21702570 0.77 ALDH1A1 (0.47) ALDH1A1PKMLMNAGAATDP1
SCHEMBL8477868 0.77 ALDH1A1 (0.61) ALDH1A1PKMGAATDP1TSHR
SCHEMBL8526538 0.76 MGLL (0.62) ALDH1A1PKMLMNATDP1HPGD
SCHEMBL3668333 0.74 MGLL (0.60) ALDH1A1PKMLMNATDP1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107245221-B Glue is used in a kind of unleaded high heat-resistant copper-clad panel production 建滔电子材料(江阴)有限公司 2019-06-07 CN claimed
US-20250277081-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DIC CORPORATION (JP) 2025-09-04 US disclosed
EP-4585594-A1 GLYCIDYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC Corporation (JP) 2025-07-16 EP disclosed
US-20250223396-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC CORPORATION (JP) 2025-07-10 US disclosed
CN-120059762-A Liquid crystal aligning agent for forming weak anchor film, method for producing liquid crystal aligning film, and method for producing liquid crystal element JSR株式会社 2025-05-30 CN disclosed
CN-120041219-A Liquid crystal aligning agent, liquid crystal alignment film, method for producing liquid crystal alignment film, liquid crystal element, and method for producing liquid crystal element JSR株式会社 2025-05-27 CN disclosed
CN-114479880-B Liquid crystal aligning agent, liquid crystal alignment film, method for producing liquid crystal alignment film, liquid crystal element, and method for producing liquid crystal element JSR株式会社 2025-05-13 CN disclosed
CN-115197719-B Liquid crystal aligning agent, liquid crystal alignment film, liquid crystal element and method for manufacturing liquid crystal element JSR株式会社 2025-03-28 CN disclosed
EP-4527834-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DIC Corporation (JP) 2025-03-26 EP disclosed
EP-4527869-A1 GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC Corporation (JP) 2025-03-26 EP disclosed
US-8104148-B2 Kind of prepolymer and its product-thermosetting resins composite ITEQ (DONGGUAN) CORPORATION (CN) 2012-01-31 US disclosed
US-20090292062-A1 THERMOSETTING RESIN COMPOSITION ITEQ (DONGGUAN) CORPORATION (CN) 2009-11-26 US disclosed
US-20090292050-A1 Kind of Prepolymer and Its Product-Thermosetting Resins Composite ITEQ CORPORATION (TW) 2009-11-26 US disclosed
US-20090292062-A1 THERMOSETTING RESIN COMPOSITION ITEQ (DONGGUAN) CORPORATION (CN) 2009-11-26 US disclosed
US-20090292050-A1 Kind of Prepolymer and Its Product-Thermosetting Resins Composite ITEQ CORPORATION (TW) 2009-11-26 US disclosed
US-6232430-B1 PYRROLIDIN-2,5-DIONE COMPOUND JDS UNIPHASE PHOTONICS C.V. (NL) 2001-05-15 US disclosed
EP-0934266-A1 CROSS-LINKERS FOR CROSS-LINKABLE OPTICAL POLYCARBONATES Akzo Nobel N.V. (NL) 1999-08-11 EP disclosed
WO-1998017644-A1 CROSS-LINKERS FOR CROSS-LINKABLE OPTICAL POLYCARBONATES AKZO NOBEL N.V. (NL) 1998-04-30 WO disclosed
US-5420184-A Polyphenylene ether, polyester, phosphite MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1995-05-30 US disclosed
EP-0593054-A2 Thermoplastic resin composition and process for preparing the same MITSUBISHI CHEMICAL CORPORATION (JP) 1994-04-20 EP disclosed