Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8849265 | 0.75 | THRB (0.44) | THRBLMNA | |
| SCHEMBL18787584 | 0.71 | THRB (0.47) | THRBLMNA | |
| SCHEMBL27602653 | 0.71 | THRB (0.40) | THRBLMNA | |
| SCHEMBL22406262 | 0.70 | THRB (0.35) | THRBLMNA | |
| SCHEMBL15349124 | 0.67 | THRB (0.36) | THRBLMNA | |
| SCHEMBL8849042 | 0.67 | LMNA (0.47) | THRBLMNA | |
| SCHEMBL8511715 | 0.67 | LMNA (0.47) | THRBLMNA | |
| SCHEMBL22116250 | 0.65 | LMNA (0.39) | THRBLMNA | |
| SCHEMBL27783875 | 0.65 | THRB (0.35) | THRBLMNA | |
| SCHEMBL8849404 | 0.65 | LMNA (0.45) | THRBLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106232668-B | Polyurethane-hot melt adhesive with low monomeric diisocyanate content and good crosslinking rate | SIKA技术股份公司 | 2019-08-23 | — | — | CN | disclosed |
| CN-107779142-A | Reactive polyolefin hotmelt with relatively low reactivating temperature and its purposes in vacuum deep-draw is laminated | SIKA技术股份公司 | 2018-03-09 | — | — | CN | disclosed |
| CN-107075337-A | Binding system with high response pretreating agent | SIKA技术股份公司 | 2017-08-18 | — | — | CN | disclosed |
| CN-106232668-A | There is low monomeric diisocyanate content and the polyurethane-hot melt adhesive of good crosslinking rate | SIKA技术股份公司 | 2016-12-14 | — | — | CN | disclosed |
| CN-102036929-B | Containing the adhesion promoter composition of aromatics secondary amino silanes | SIKA TECHNOLOGY AG (CH) | 2016-01-20 | — | — | CN | disclosed |
| CN-102666769-B | Hot-melt adhesive composition with good adhesion not only to polar but also to non-polar substrates | SIKA TECHNOLOGY AG | 2015-06-03 | — | — | CN | disclosed |
| US-8865822-B2 | Hot melt adhesive compositions having good adhesion on both polar and nonpolar substrates | SIKA TECHNOLOGY AG (CH) | 2014-10-21 | — | — | US | disclosed |
| CN-101573305-B | Low temperature adhesive primer composition | SIKA TECHNOLOGY AG | 2013-03-13 | — | — | CN | disclosed |
| US-20120315491-A1 | HOT MELT ADHESIVE COMPOSITIONS HAVING GOOD ADHESION ON BOTH POLAR AND NONPOLAR SUBSTRATES | SIKA TECHNOLOGY AG (CH) | 2012-12-13 | — | — | US | disclosed |
| CN-102666769-A | Hot-melt adhesive composition with good adhesion not only to polar but also to non-polar substrates | SIKA TECHNOLOGY AG | 2012-09-12 | — | — | CN | disclosed |
| CN-101591466-B | Adhesive compound containing epoxy resin | SIKA TECHNOLOGY AG (CH) | 2011-12-14 | — | — | CN | disclosed |
| CN-102036929-A | Aromatic secondary adhesive compositions containing aminosilane | SIKA TECHNOLOGY AG | 2011-04-27 | — | — | CN | disclosed |
| CN-101591466-A | The adhesion promoter composition that comprises Resins, epoxy | SIKA TECHNOLOGY AG (CH) | 2009-12-02 | — | — | CN | disclosed |
| CN-101573305-A | Low temperature adhesive primer composition | SIKA TECHNOLOGY AG (CH) | 2009-11-04 | — | — | CN | disclosed |
| US-6177526-B1 | METALLOCENE; COCATALYST; MODIFIED OXIDE CONTAINS ORGANIC SILICON RADICALS CONTAINING AT LEAST ONE OF THE GROUPS NITROGEN, FLUORINE, PHOSPHORUS OR SULFUR. | TARGOR GMBH (DE) | 2001-01-23 | — | — | US | disclosed |