SCHEMBL7934391

SCHEMBL7934391

CCCCCCCCCCCCCCCCCCCC(C(=O)NN)C(=O)NN

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.55
CA1 P00915 1/20 0.55
ALDH1A1 P00352 1/20 0.46
KMT2A Q03164 1/20 0.46
GPR84 Q9NQS5 7/20 0.45
FFAR1 O14842 1/20 0.45
GNAI3 P08754 1/20 0.45
GNAO1 P09471 1/20 0.45
GNAI1 P63096 1/20 0.45
ZDHHC7 Q9NXF8 1/20 0.44
MAPT P10636 1/20 0.44
LCK P06239 1/20 0.44
PPARD Q03181 1/20 0.44
ZDHHC20 Q5W0Z9 1/20 0.44
ZDHHC2 Q9UIJ5 1/20 0.44
RRM1 P23921 1/20 0.43
DPP7 Q9UHL4 1/20 0.43
LAP3 P28838 1/20 0.42
GRIK1 P39086 1/20 0.42
GRIK2 Q13002 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14095068 1.00 CA2 (0.55) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL6670118 1.00 CA2 (0.55) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL1929627 1.00 CA2 (0.55) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL3693835 1.00 CA2 (0.55) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL27969309 0.98 CA1 (0.57) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL28212848 0.90 CA1 (0.50) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL30315003 0.89 FAAH (0.47) CA2CA1ALDH1A1KMT2AFFAR1
SCHEMBL13808654 0.83 CA2 (0.71) CA2CA1ALDH1A1KMT2AGPR84
SCHEMBL10052282 0.82 CA1 (0.52) CA2CA1ALDH1A1KMT2ADPP7
SCHEMBL5153127 0.82 CA1 (0.53) CA2CA1ALDH1A1KMT2AGPR84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112262174-A Epoxy resin formulations 赫克塞尔合成有限公司 2021-01-22 CN disclosed
US-6180719-B1 MOLDING MATERIAL OF AN EPOXIDIZED BLOCK COPOLYMER OF A VINYL AROMATIC HYDROCARBON AND CONJUGATED DIENE, OR HYDROGENATED PRODUCTS THEREOF, AND SPECIFIED THERMOPLASTIC ELASTOMER(S); MOLDINGS SUCH AS TURNTABLE OF A CD-ROM DRIVER DAICEL CHEMICAL INDUSTRIES LTD (JP) 2001-01-30 US disclosed
EP-0878505-A1 HEAT-FUSIBLE COMPOSITIONS AND MULTI-LAYER MOLDINGS COMPRISING LAYERS MADE THEREFROM Daicel Chemical Industries, Ltd. (JP) 1998-11-18 EP disclosed
US-5534569-A KNEADING RUBBERS WITH CARBON BLACK, HYDRAZINE, HYDRAZIDE OR HYDANTOIN COMPOUNDS BRIDGESTONE CORPORATION (JP) 1996-07-09 US disclosed
EP-0258040-B1 Thermoplastic resin composition comprising a polyamide SUMITOMO CHEMICAL CO (JP) 1993-11-24 EP disclosed
EP-0284379-B1 PROCESS FOR PRODUCING POLYMERIC POLYAMIDE RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1992-12-30 EP disclosed
EP-0478274-A1 Rubber composition Bridgestone Corporation (JP) 1992-04-01 EP disclosed
EP-0279578-B1 MOLDABLE THERMOPLASTIC POLYAMIDE COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-12-11 EP disclosed
US-5047479-A MIXTURE OF POLYAMIDE RESIN, ETHYLENE COPOLYMER, AND A COMPOUND CONTAINING AT LEAST TWO AMINO GROUPS; IMPACT RESISTANCE SUMITOMO CHEMICAL CO., LTD. (JP) 1991-09-10 US disclosed
US-5047478-A Crosslinked Polyamide, Ethylene Copolymer Blend For Molded Articles SUMITOMO CHEMICAL CO., LTD. (JP) 1991-09-10 US disclosed
EP-0284379-A2 Process for producing polymeric polyamide resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-09-28 EP disclosed
EP-0279578-A1 Moldable thermoplastic polyamide composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-08-24 EP disclosed
EP-0258040-A1 Thermoplastic resin composition comprising a polyamide SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-03-02 EP disclosed