Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.47 |
| ▸ | TSHR | P16473 | 1/20 | 0.47 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.47 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.47 |
| ▸ | MAOB | P27338 | 1/20 | 0.47 |
| ▸ | TGM2 | P21980 | 1/20 | 0.47 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | HTT | P42858 | 2/20 | 0.46 |
| ▸ | NPC1 | O15118 | 3/20 | 0.45 |
| ▸ | RAB9A | P51151 | 3/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.45 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.45 |
| ▸ | MEN1 | O00255 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.44 |
| ▸ | MGLL | Q99685 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29790025 | 1.00 | ALDH1A1 (0.47) | ALDH1A1TSHRKEAP1NFE2L2MAOB | |
| SCHEMBL11964039 | 0.99 | ALDH1A1 (0.49) | ALDH1A1TSHRKEAP1NFE2L2MAOB | |
| SCHEMBL6448999 | 0.94 | MGLL (0.53) | ALDH1A1MAOBCYP2C19POLBKMT2A | |
| SCHEMBL7745723 | 0.94 | KAT2B (0.45) | ALDH1A1TSHRKEAP1NFE2L2MAOB | |
| SCHEMBL10401227 | 0.94 | MGLL (0.53) | ALDH1A1MAOBCYP2C19POLBKMT2A | |
| SCHEMBL3612593 | 0.94 | MGLL (0.53) | ALDH1A1MAOBCYP2C19POLBKMT2A | |
| SCHEMBL1053903 | 0.94 | MGLL (0.53) | ALDH1A1MAOBCYP2C19POLBKMT2A | |
| SCHEMBL30640871 | 0.93 | HTT (0.55) | ALDH1A1TSHRKEAP1NFE2L2MAOB | |
| SCHEMBL6865424 | 0.93 | EPHX2 (0.44) | ALDH1A1TSHRKEAP1NFE2L2MAOB | |
| SCHEMBL9782583 | 0.89 | ALDH1A1 (0.48) | ALDH1A1TSHRMAOBCYP2C19POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| EP-2799928-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | TORAY INDUSTRIES (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| US-9704724-B2 | Photosensitive resin composition and method for producing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-11 | — | — | US | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| US-8394573-B2 | Photoresist compositions and methods for shrinking a photoresist critical dimension | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-03-12 | — | — | US | disclosed |
| US-20120070787-A1 | PHOTORESIST COMPOSITIONS AND METHODS FOR SHRINKING A PHOTORESIST CRITICAL DIMENSION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-03-22 | — | — | US | disclosed |
| US-20120070787-A1 | PHOTORESIST COMPOSITIONS AND METHODS FOR SHRINKING A PHOTORESIST CRITICAL DIMENSION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-03-22 | — | — | US | disclosed |
| US-7838200-B2 | Photoresist compositions and method for multiple exposures with multiple layer resist systems | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-11-23 | — | — | US | disclosed |
| US-7838200-B2 | Photoresist compositions and method for multiple exposures with multiple layer resist systems | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-11-23 | — | — | US | disclosed |
| US-7718343-B2 | Decomposable resin composition and pattern-forming material including the same | FUJIFILM CORPORATION (JP) | 2010-05-18 | — | — | US | disclosed |
| WO-2009074522-A1 | PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-18 | — | — | WO | disclosed |
| US-20090155715-A1 | PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-18 | — | — | US | disclosed |
| US-20090155715-A1 | PHOTORESIST COMPOSITIONS AND METHOD FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER RESIST SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-18 | — | — | US | disclosed |
| US-20080070154-A1 | DECOMPOSABLE RESIN COMPOSITION AND PATTERN-FORMING MATERIAL INCLUDING THE SAME | FUJIFILM CORPORATION (JP) | 2008-03-20 | — | — | US | disclosed |