SCHEMBL7994346

SCHEMBL7994346

C(=C/c1ccccc1)\C[n+]1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 2/20 0.47
CHRNA7 P36544 1/20 0.46
IDO1 P14902 2/20 0.45
PAM P19021 1/20 0.45
CHAT P28329 2/20 0.43
HTR2A P28223 3/20 0.42
BCHE P06276 2/20 0.42
ACHE P22303 2/20 0.42
MAOB P27338 1/20 0.42
INSR P06213 1/20 0.38
NPC1 O15118 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7994352 1.00 RAB9A (0.47) RAB9ACHRNA7IDO1PAMCHAT
Iodide SCHEMBL8910696 0.98 CHRNA7 (0.49) RAB9ACHRNA7IDO1PAMCHAT
SCHEMBL9003935 0.80 LCK (0.50)
Iodide SCHEMBL23888749 0.79 RELA (0.53) RAB9AINSRNPC1L3MBTL1
Iodide SCHEMBL23888751 0.79 RELA (0.53) RAB9AINSRNPC1L3MBTL1
SCHEMBL9777486 0.73 IDO1 (0.58) RAB9AIDO1PAMHTR2AMAOB
SCHEMBL4863423 0.73 IDO1 (0.58) RAB9AIDO1PAMHTR2AMAOB
SCHEMBL2541656 0.72 IDO1 (0.52) RAB9AIDO1PAMHTR2AMAOB
SCHEMBL3927955 0.72 IDO1 (0.52) RAB9AIDO1PAMHTR2AMAOB
SCHEMBL7939387 0.71 IDO1 (0.56) RAB9AIDO1PAMHTR2AMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118843910-A Conductive particle, adhesive film for circuit connection and method for producing same, connection structure and method for producing same 株式会社力森诺科 2024-10-25 CN disclosed
CN-118830029-A Conductive particle, adhesive film for circuit connection and method for producing same, connection structure and method for producing same 株式会社力森诺科 2024-10-22 CN disclosed
WO-2024150767-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2024150762-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2024150766-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2023171633-A1 ELECTRICALLY CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, AND CONNECTION STRUCTURE BODY AND METHOD FOR MANUFACTURING SAME 株式会社レゾナック 2023-09-14 WO disclosed
WO-2023171634-A1 CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR 株式会社レゾナック 2023-09-14 WO disclosed
CN-101400719-B Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those HITACHI CHEMICAL CO LTD 2013-01-23 CN disclosed
CN-101356452-B Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL CO LTD 2011-09-21 CN disclosed
CN-101400719-A Phenoxy resin for optical material, resin composition for optical material, resin film for optical material, and optical waveguide using those HITACHI CHEMICAL CO LTD (JP) 2009-04-01 CN disclosed
CN-101356452-A Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2009-01-28 CN disclosed
US-6280981-B1 MONITORING SUBCELLULAR COMPARTMENTS SUCH AS ORGANELLES BY ENERGY TRANSFER TECHNIQUES THAT DO NOT REQUIRE SPECIFIC INTERMOLECULAR AFFINITY BINDING EVENTS BETWEEN ENERGY TRANSFER DONOR AND ENERGY TRANSFER ACCEPTOR MOLECULES MITOKOR 2001-08-28 US disclosed