Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNA7 | P36544 | 1/20 | 0.46 |
| ▸ | ACHE | P22303 | 6/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.35 |
| ▸ | STAT3 | P40763 | 1/20 | 0.32 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | CA7 | P43166 | 1/20 | 0.32 |
| ▸ | CA9 | Q16790 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | TAS1R3 | Q7RTX0 | 1/20 | 0.31 |
| ▸ | TAS1R1 | Q7RTX1 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8750619 | 0.80 | CHRNA7 (0.46) | CHRNA7ACHETDP1ALOX5STAT3 | |
| SCHEMBL6202387 | 0.78 | IDO1 (0.43) | ACHE | |
| SCHEMBL3102669 | 0.77 | TAAR1 (0.41) | ALDH1A1LMNA | |
| SCHEMBL28346241 | 0.75 | PTGS2 (0.48) | ALDH1A1GAA | |
| SCHEMBL2431139 | 0.74 | ACHE (0.44) | CHRNA7ACHETDP1CYP19A1ALDH1A1 | |
| SCHEMBL8750364 | 0.74 | CHRNA7 (0.50) | CHRNA7ACHETDP1ALOX5STAT3 | |
| SCHEMBL16406583 | 0.73 | MAPT (0.45) | ACHEALDH1A1GAAKMT2A | |
| SCHEMBL8750611 | 0.73 | CHRNA7 (0.40) | CHRNA7ACHETDP1ALOX5STAT3 | |
| SCHEMBL27273704 | 0.73 | ACHE (0.44) | ACHECYP19A1ALDH1A1GAA | |
| SCHEMBL20220566 | 0.72 | CHRNA7 (0.39) | CHRNA7ACHETDP1ALOX5STAT3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112292431-B | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2022-09-02 | — | — | CN | disclosed |
| CN-114730706-A | Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-113348533-B | Method for evaluating pickup property, die-cut/die-bond integrated film, method for evaluating the same, method for sorting the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-113366621-B | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-12-31 | — | — | CN | disclosed |
| CN-112219264-B | Die-cut/die-bond integrated film, method for producing same, and method for producing semiconductor device | 昭和电工材料株式会社 | 2021-12-03 | — | — | CN | disclosed |
| CN-113366621-A | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-09-07 | — | — | CN | disclosed |
| CN-113348533-A | Method for evaluating pickup property, die-cut and die-bond integrated film, method for evaluating die-cut and die-bond integrated film, method for sorting die-cut and die-bond integrated film, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-09-03 | — | — | CN | disclosed |
| WO-2021095369-A1 | INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2021-05-20 | — | — | WO | disclosed |
| WO-2021095370-A1 | DICING DIE-BONDING INTEGRATED FILM, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 昭和電工マテリアルズ株式会社 | 2021-05-20 | — | — | WO | disclosed |
| CN-112292431-A | Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same | 昭和电工材料株式会社 | 2021-01-29 | — | — | CN | disclosed |
| CN-1156532-C | Epoxy-resin composition and use thereof | 三井化学株式会社 | 2004-07-07 | — | — | CN | disclosed |
| CN-1400993-A | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2003-03-05 | — | — | CN | disclosed |
| US-6080522-A | CONTAINING PHOTORESIST AND POLYMER | CLARIANT INTERNAITONAL, LTD. (CH) | 2000-06-27 | — | — | US | disclosed |
| CN-1239116-A | Epoxy-resin composition and use thereof | MITSUI CHEMICALS INC (US) | 1999-12-22 | — | — | CN | disclosed |
| CN-1229480-A | Radiation-sensitive resist composition with high heat resistance | CLARIANT INT LTD (CH) | 1999-09-22 | — | — | CN | disclosed |
| CN-1062544-A | The compositions of thermosetting resin that contains arylamino resin | MITSUI TOATSU CHEMICALS (JP) | 1992-07-08 | — | — | CN | disclosed |
| CN-1017055-B | Process for producing aromatic amine resin | MITSUI TOATSU CHEMICALS (JP) | 1992-06-17 | — | — | CN | disclosed |
| US-5068293-A | Heat resistant and moisture resistant epoxy resin for molding materials | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1991-11-26 | — | — | US | disclosed |
| EP-0415790-A2 | Naphthol-based epoxy resins, intermediates for the same, process for preparing the same, and epoxy resin compositions containing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1991-03-06 | — | — | EP | disclosed |
| CN-1032806-A | Aromatic amine resin, its preparation method and application in thermosetting resin composition | MITSUI TOATSU CHEMICALS (JP) | 1989-05-10 | — | — | CN | disclosed |