SCHEMBL801344

SCHEMBL801344

CCCCOC(=O)CCCCCOC(=O)c1ccccc1C(=O)OCC(O)COC(=O)C(C)(C)CC

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.52
TSHR P16473 4/20 0.52
LMNA P02545 1/20 0.52
TDP1 Q9NUW8 2/20 0.51
L3MBTL1 Q9Y468 2/20 0.51
CYP3A4 P08684 3/20 0.50
MAPK1 P28482 2/20 0.50
TP53 P04637 1/20 0.50
HSD17B10 Q99714 2/20 0.45
KDM4E B2RXH2 2/20 0.45
POLB P06746 1/20 0.45
PRSS1 P07477 1/20 0.43
PRSS2 P07478 1/20 0.43
PRSS3 P35030 1/20 0.43
CA2 P00918 1/20 0.42
CNR2 P34972 3/20 0.42
LPAR6 P43657 1/20 0.41
LPAR1 Q92633 1/20 0.41
LPAR4 Q99677 1/20 0.41
LPAR5 Q9H1C0 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14680434 1.00 ALDH1A1 (0.52) ALDH1A1TSHRLMNATDP1L3MBTL1
SCHEMBL801349 0.85 LPAR1 (0.53) LMNAKDM4ELPAR6LPAR1LPAR4
SCHEMBL12452045 0.85 LPAR1 (0.53) LMNAKDM4ELPAR6LPAR1LPAR4
SCHEMBL17084866 0.83 LPAR1 (0.58) LMNAKDM4ECNR2LPAR6LPAR1
SCHEMBL12691517 0.83 LPAR1 (0.58) LMNAKDM4ECNR2LPAR6LPAR1
SCHEMBL12452128 0.82 LPAR1 (0.51) LMNAKDM4ECNR2LPAR6LPAR1
SCHEMBL12452124 0.82 LPAR1 (0.51) LMNAKDM4ECNR2LPAR6LPAR1
SCHEMBL801340 0.82 LPAR1 (0.48) LMNAKDM4ELPAR6LPAR1LPAR4
SCHEMBL10093734 0.82 ALDH1A1 (0.43) ALDH1A1TSHRLMNATDP1L3MBTL1
SCHEMBL12309886 0.82 ALDH1A1 (0.43) ALDH1A1TSHRLMNATDP1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9818778-B2 Solid-state image sensor and its manufacturing method, curable composition for forming infrared cut-off filters, and camera module FUJIFILM CORPORATION (JP) 2017-11-14 US disclosed
US-20150372037-A1 SOLID-STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD, CURABLE COMPOSITION FOR FORMING INFRARED CUT-OFF FILTERS, AND CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-12-24 US disclosed
US-8766388-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2014-07-01 US disclosed
US-8735483-B2 Polymerizable composition FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 US disclosed