Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | THPO | P40225 | 1/20 | 0.31 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.31 |
| ▸ | LCK | P06239 | 1/20 | 0.31 |
| ▸ | FYN | P06241 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL10705951 | 0.93 | ALDH1A1 (0.39) | ALDH1A1LMNATSHRTHPOFFAR3 | |
| SCHEMBL1422350 | 0.93 | ALDH1A1 (0.44) | ALDH1A1LMNATSHRTHPOFFAR3 | |
| SCHEMBL36528 | 0.93 | — | — | |
| Methane SCHEMBL28300736 | 0.89 | — | — | |
| Acetone SCHEMBL27988781 | 0.89 | LMNA (0.46) | ALDH1A1LMNATSHRTHPOFFAR3 | |
| SCHEMBL10400342 | 0.89 | — | — | |
| Acetone SCHEMBL9445711 | 0.89 | LMNA (0.46) | ALDH1A1LMNATSHRTHPOFFAR3 | |
| SCHEMBL28488745 | 0.89 | — | — | |
| Ethylene SCHEMBL10778933 | 0.86 | — | — | |
| Formaldehyde SCHEMBL11219152 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4830714-A | Process for the production of printed circuit boards | BAYER AKTIENGESELLSCHAFT (DE) | 1989-05-16 | — | — | US | claimed |
| EP-0153683-B1 | PROCESS FOR MAKING CIRCUIT BOARDS | BAYER AG (DE) | 1989-04-12 | — | — | EP | claimed |
| EP-0153683-A2 | Process for making circuit boards | BAYER AG (DE) | 1985-09-04 | — | — | EP | claimed |
| EP-0814182-B1 | Process for producing strip-shaped metal coated foil | BAYER AG (DE) | 2000-08-30 | — | — | EP | disclosed |
| EP-0508265-B1 | Process for activating substrates surfaces for electrolysis | BAYER AG (DE) | 2000-01-12 | — | — | EP | disclosed |
| US-5888372-A | Process for producing metal-coated films in web form | BAYER AKTIENGESELLSCHAFT (DE) | 1999-03-30 | — | — | US | disclosed |
| EP-0814182-A1 | Process for producing strip-shaped metal coated foil | BAYER AG (DE) | 1997-12-29 | — | — | EP | disclosed |
| EP-0562393-B1 | Process for improving the adhesion of electrolessly deposited metal coatings | BAYER AG (DE) | 1995-11-08 | — | — | EP | disclosed |
| US-5436034-A | Process for improving the adhesiveness of electrolessly deposited metal films | BAYER AKTIENGESELLSCHAFT (DE) | 1995-07-25 | — | — | US | disclosed |
| EP-0485839-B1 | Primer for metallization | BAYER AG (DE) | 1995-01-04 | — | — | EP | disclosed |
| US-5378268-A | Primer for the metallization of substrate surfaces | BAYER AKTIENGESELLSCHAFT (DE) | 1995-01-03 | — | — | US | disclosed |
| EP-0131195-B1 | PROCESS FOR THE ACTIVATION OF SUBSTRATES FOR ELECTROLESS METAL PLATING | BAYER AG (DE) | 1987-08-12 | — | — | EP | disclosed |
| EP-0146724-B1 | PROCESS FOR PRE-TREATING POLYAMIDE SUBSTRATES FOR ELECTROLESS PLATING | BAYER AG (DE) | 1987-05-13 | — | — | EP | disclosed |
| EP-0195332-A2 | Printed circuits | BAYER AG (DE) | 1986-09-24 | — | — | EP | disclosed |
| US-4575467-A | Process for activating substrates for electroless metallization | BAYER AKTIENGESELLSCHAFT (DE) | 1986-03-11 | — | — | US | disclosed |
| EP-0166327-A2 | Process for manufacturing printed circuit boards | BAYER AG (DE) | 1986-01-02 | — | — | EP | disclosed |
| US-4554183-A | Process for pretreating polyamide substrates for electroless metallization | BAYER AKTIENGESELLSCHAFT (DE) | 1985-11-19 | — | — | US | disclosed |
| EP-0153683-A2 | Process for making circuit boards | BAYER AG (DE) | 1985-09-04 | — | — | EP | disclosed |
| EP-0146724-A1 | Process for pre-treating polyamide substrates for electroless plating | BAYER AG (DE) | 1985-07-03 | — | — | EP | disclosed |
| EP-0131195-A2 | Process for the activation of substrates for electroless metal plating | BAYER AG (DE) | 1985-01-16 | — | — | EP | disclosed |