SCHEMBL8060222

SCHEMBL8060222

O=P(O)(O)OCC(O)(O)O

nearest known ligand 0.39

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
FBP1 P09467 1/20 0.39
TPI1 P60174 2/20 0.37
LPAR3 Q9UBY5 4/20 0.36
LPAR2 Q9HBW0 3/20 0.36
LPAR1 Q92633 2/20 0.36
PGK1 P00558 1/20 0.36
PGK2 P07205 1/20 0.36
FDPS P14324 1/20 0.35
BLM P54132 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
PGD P52209 2/20 0.33
MPI P34949 1/20 0.33
S1PR1 P21453 2/20 0.32
S1PR3 Q99500 2/20 0.32
SMPD1 P17405 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL28263292 0.88 LPAR3 (0.39) TPI1LPAR3LPAR2LPAR1FDPS
SCHEMBL15725546 0.79 FBP1 (0.41) FBP1TPI1LPAR3LPAR2LPAR1
Ammonia Solution, Strong SCHEMBL26660491 0.76 LMNA (0.38) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL9013448 0.76 LPAR3 (0.41) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL11543945 0.74 FBP1 (0.38) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL5974079 0.74 LPAR3 (0.39) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL29079493 0.74 TPI1 (0.39) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL1978140 0.74 FBP1 (0.38) FBP1TPI1LPAR3LPAR2LPAR1
Triclofos SCHEMBL125854 0.74 FBP1 (0.38) FBP1TPI1LPAR3LPAR2LPAR1
SCHEMBL2470417 0.74 LPAR3 (0.39) FBP1TPI1LPAR3LPAR2LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113881376-B Bio-based epoxy resin pouring sealant and preparation method thereof 江南大学 2022-11-11 CN claimed
CN-113881376-A Bio-based epoxy resin pouring sealant and preparation method thereof 江南大学 2022-01-04 CN claimed
EP-4589066-A1 TREATMENT AGENT FOR ACRYLIC FIBERS AND USE OF SAME Matsumoto Yushi-Seiyaku Co., Ltd. (JP) 2025-07-23 EP disclosed
WO-2025023103-A1 TREATMENT AGENT FOR CARBON FIBER PRECURSOR AND USE THEREOF 松本油脂製薬株式会社 2025-01-30 WO disclosed
CN-115181435-B Surface modification method of carbon black flame-retardant pigment for in-situ polymerization polyester chip 江南大学 2024-03-01 CN disclosed
CN-113881376-B Bio-based epoxy resin pouring sealant and preparation method thereof 江南大学 2022-11-11 CN disclosed
CN-113881376-A Bio-based epoxy resin pouring sealant and preparation method thereof 江南大学 2022-01-04 CN disclosed
US-6051368-A A MIXTURE COMPRISING AN ORGANIC POLYMER BINDER OF A CELLULOSE ETHER AND AN ALKALI-SOLUBLE RESIN, A PHOTO-CROSSLINKABLE COMPOUND AND A PHOTO-RADICAL GENERATING AGENT; FORMING A FLUORESCENT SCREEN, SIDE SURFACES OF A PLASMA DISPLAY PANEL JSR CORPORATION (JP) 2000-04-18 US disclosed
US-5792589-A ORGANIC BINDER; OPTICALLY CROSSLINKABLE COMPOUND; RADICAL-GENERATING AGENT: 2,4,5-TRIARYL IMIDAZOLE DIMER, AMINO-GROUP CONTAINING BENZOPHENONE PHOTOSENSITIZER, A THIOL COMPOUND JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-08-11 US disclosed
US-4022757-A Dicarbamic acid diesters containing phosphorus BAYER AKTIENGESELLSCHAFT (DT) 1977-05-10 US disclosed