Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.44 |
| ▸ | MAPT | P10636 | 3/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.44 |
| ▸ | LMNA | P02545 | 3/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.44 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.44 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | FSHR | P23945 | 1/20 | 0.40 |
| ▸ | ATM | Q13315 | 1/20 | 0.39 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | KDM1A | O60341 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 2/20 | 0.34 |
| ▸ | PLIN1 | O60240 | 1/20 | 0.33 |
| ▸ | PLIN5 | Q00G26 | 1/20 | 0.33 |
| ▸ | ABHD5 | Q8WTS1 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27862690 | 0.92 | FSHR (0.44) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL27224482 | 0.84 | FSHR (0.40) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL503853 | 0.84 | MEN1 (0.46) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL29436894 | 0.84 | MEN1 (0.46) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL140434 | 0.84 | FSHR (0.42) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL29374824 | 0.84 | FSHR (0.42) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL137367 | 0.84 | FSHR (0.42) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL29409547 | 0.84 | FSHR (0.42) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| SCHEMBL8948017 | 0.83 | OPRM1 (0.40) | MEN1KMT2AMAPTSMN1; SMN2LMNA | |
| Water SCHEMBL27831248 | 0.82 | MEN1 (0.45) | MEN1KMT2AMAPTSMN1; SMN2LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022191017-A1 | POLYIMIDE RESIN, METHOD FOR PRODUCING POLYIMIDE RESIN, POLYIMIDE RESIN SOLUTION, COATING MATERIAL, AND MOLDING MATERIAL | ＪＦＥケミカル株式会社 | 2022-09-15 | — | — | WO | claimed |
| US-5242748-A | Kincreasing the toughtness of a curable epoxy resin by adding a soluble or swellable thermoplastic polyimide which is fusible at resin curing temperature | BASF AKTIENGESELLSCHAFT (DE) | 1993-09-07 | — | — | US | claimed |
| US-20240066778-A1 | FLAME-RETARDANT CROSSLINKED ALIPHATIC POLYKETONES | CARL FREUDENBERG KG (DE) | 2024-02-29 | — | — | US | disclosed |
| US-20240066778-A1 | FLAME-RETARDANT CROSSLINKED ALIPHATIC POLYKETONES | CARL FREUDENBERG KG (DE) | 2024-02-29 | — | — | US | disclosed |
| US-20230303822-A1 | Thermoset Resin Compositions | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC | 2023-09-28 | — | — | US | disclosed |
| US-20230303822-A1 | Thermoset Resin Compositions | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC | 2023-09-28 | — | — | US | disclosed |
| CN-115763917-A | High-temperature proton exchange membrane with high phosphoric acid retention rate and preparation method and application thereof | 上海四羿科技有限公司 | 2023-03-07 | — | — | CN | disclosed |
| EP-4100457-A1 | CROSS-LINKED ALIPHATIC POLYKETONES | Freudenberg SE (DE) | 2022-12-14 | — | — | EP | disclosed |
| WO-2022191017-A1 | POLYIMIDE RESIN, METHOD FOR PRODUCING POLYIMIDE RESIN, POLYIMIDE RESIN SOLUTION, COATING MATERIAL, AND MOLDING MATERIAL | ＪＦＥケミカル株式会社 | 2022-09-15 | — | — | WO | disclosed |
| CN-111344130-B | Method for manufacturing substrate for flexible device | 日产化学株式会社 | 2022-08-19 | — | — | CN | disclosed |
| CN-112142974-B | Chain extender for improving elongation of photosensitive polyimide and formulation thereof | 哈钦森技术股份有限公司 | 2022-08-16 | — | — | CN | disclosed |
| US-20070254243-A1 | METHOD FOR MANUFACTURING PHOTOSENSITIVE RESIN COMPOSITION AND RELIEF PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |
| US-20070212899-A1 | Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same | FUJIFILM CORPORATION (JP) | 2007-09-13 | — | — | US | disclosed |
| US-20070172753-A1 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2007-07-26 | — | — | US | disclosed |
| US-20070048656-A1 | Photosensitive resin composition and method for manufacturing semiconductor device using the same | FUJI PHOTO FILM CO., LTD. | 2007-03-01 | — | — | US | disclosed |
| EP-0725302-B1 | A process of producing a polyimide block copolymer | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 2002-04-03 | — | — | EP | disclosed |
| EP-0725302-A2 | A process of producing a polyimide block copolymer | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1996-08-07 | — | — | EP | disclosed |
| EP-0383174-A2 | Toughened thermosetting structural materials | CYTEC TECHNOLOGY CORP. (US) | 1990-08-22 | — | — | EP | disclosed |
| EP-0379467-A2 | Nitrogen-containing polymers with terminal hydroxyl groups | CIBA-GEIGY AG (CH) | 1990-07-25 | — | — | EP | disclosed |
| EP-0379468-A2 | Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups | CIBA-GEIGY AG (CH) | 1990-07-25 | — | — | EP | disclosed |