SCHEMBL8086823

SCHEMBL8086823

O=[N+]([O-])c1c(O)c(F)c(F)c(F)c1F

nearest known ligand 0.47

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
S100A4 P26447 2/20 0.39
GRIN2D O15399 2/20 0.36
GRIN3B O60391 2/20 0.36
GRIN1 Q05586 2/20 0.36
GRIN2A Q12879 2/20 0.36
GRIN2B Q13224 2/20 0.36
GRIN2C Q14957 2/20 0.36
GRIN3A Q8TCU5 2/20 0.36
GPR35 Q9HC97 3/20 0.34
VCP P55072 1/20 0.33
MEN1 O00255 1/20 0.32
LMNA P02545 1/20 0.32
HTT P42858 1/20 0.32
KMT2A Q03164 1/20 0.32
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26343938 0.92 S100A4 (0.40) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL25355025 0.88 S100A4 (0.38) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL27990514 0.87 S100A4 (0.40) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL7794447 0.87 S100A4 (0.40) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL27498639 0.82 GPR35 (0.36) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL17744592 0.82 S100A4 (0.34) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL30786720 0.82 GRIN2D (0.42) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL8306891 0.82 GPR35 (0.36) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL27491841 0.82 GPR35 (0.36) S100A4GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL28684589 0.82 S100A4 (0.40) S100A4GRIN2DGRIN3BGRIN1GRIN2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
CN-115044040-B Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method 信越化学工业株式会社 2024-07-02 CN disclosed
US-20240027902-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-25 US disclosed
US-20230359119-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-09 US disclosed
US-20230305393-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
EP-4056627-B1 POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-08-23 EP disclosed
US-20220289911-A1 POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-09-15 US disclosed
EP-4056627-A1 POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-09-14 EP disclosed
CN-115044040-A Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern formation method 信越化学工业株式会社 2022-09-13 CN disclosed
US-6048986-A DEHYDRATION OF DIFLUOROPYROMELLITIC ACID TO FORM DIFLUOROPYROMELLITIC DIANHYDRIDE NIPPON TELEGRAPH AND TELEPHONE CORP. (JP) 2000-04-11 US disclosed
US-5849934-A Method for preparing aromatic compounds NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1998-12-15 US disclosed
US-5750731-A POLYIMIDE ANHYDRIDE MONOMERS NIPPON TELEGRAPH & TELEPHONE CORPORATION (JP) 1998-05-12 US disclosed
EP-0480266-B1 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH & TELEPHONE (JP) 1996-06-26 EP disclosed
US-5449741-A Electronics with impact strength NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1995-09-12 US disclosed
US-5233018-A Heat resistance and low optical transmission loss in the near-infrared region; integrated circuits NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1993-08-03 US disclosed
EP-0480266-A2 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-15 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 S100A4 1208/4885GRIN2D 169/4885GRIN3B 1795/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.