⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10705114 | 0.82 | TSHR (0.31) | — | |
| SCHEMBL8155361 | 0.82 | ALDH1A1 (0.32) | — | |
| SCHEMBL2526183 | 0.79 | ALDH1A1 (0.41) | — | |
| SCHEMBL6911076 | 0.78 | — | — | |
| SCHEMBL2519828 | 0.75 | ALDH1A1 (0.36) | — | |
| SCHEMBL762567 | 0.72 | TSHR (0.38) | — | |
| SCHEMBL421091 | 0.72 | ALDH1A1 (0.33) | — | |
| SCHEMBL8156378 | 0.71 | — | — | |
| Acrylic Acid SCHEMBL29165216 | 0.69 | LMNA (0.42) | — | |
| Acrylic Acid SCHEMBL15876790 | 0.69 | LMNA (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12360451-B2 | Method of manufacturing semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-07-15 | — | — | US | disclosed |
| US-20250149336-A1 | PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-05-08 | — | — | US | disclosed |
| US-20240302742-A1 | PHOTORESIST COMPOSITION INCLUDING PHOTOSENSITIVE POLYMER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-09-12 | — | — | US | disclosed |
| WO-2023242193-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE MEMBER USING THE COMPOSITION | WACKER CHEMIE AG (DE) | 2023-12-21 | — | — | WO | disclosed |
| US-20230288806-A1 | PHOTOSENSITIVE POLYMER CAPABLE OF MULTI-STEP DEPROTECTION REACTION, PHOTORESIST COMPOSITION INCLUDING THE PHOTOSENSITIVE POLYMER, AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-09-14 | — | — | US | disclosed |
| US-20220299874-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | INHA INDUSTRY PARTNERSHIP INSTITUTE (KR) | 2022-09-22 | — | — | US | disclosed |
| US-20220252982-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2022-08-11 | — | — | US | disclosed |
| US-20220252976-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2022-08-11 | — | — | US | disclosed |
| US-20210380612-A1 | PHOTORESIST COMPOSITIONS | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2021-12-09 | — | — | US | disclosed |
| US-9389339-B2 | Method for producing antireflection film, antireflection film, and coating composition | FUJIFILM CORPORATION (JP) | 2016-07-12 | — | — | US | disclosed |
| US-20160184789-A1 | MICROCHEMICAL CHIP AND REACTION DEVICE | ASAHI FR R&D CO., LTD. (JP) | 2016-06-30 | — | — | US | disclosed |
| US-20160187540-A2 | METHOD FOR PRODUCING ANTIREFLECTION FILM, ANTIREFLECTION FILM, AND COATING COMPOSITION | FUJIFILM CORPORATION (JP) | 2016-06-30 | — | — | US | disclosed |
| CN-105517970-A | Optical fiber coating for short data network | CORNING INC | 2016-04-20 | — | — | CN | disclosed |
| US-20120270021-A1 | METHOD FOR PRODUCING ANTIREFLECTION FILM, ANTIREFLECTION FILM, AND COATING COMPOSITION | FUJIFILM CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| EP-0708143-B1 | Polyvinyl chloride based resin composition and products derived therefrom | SEKISUI AMERICA CORP (US) | 2000-01-05 | — | — | EP | disclosed |
| EP-0708143-A1 | Polyvinyl chloride based resin composition and products derived therefrom | SEKISUI AMERICA CORPORATION (US) | 1996-04-24 | — | — | EP | disclosed |