Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 4/20 | 0.55 |
| ▸ | CA2 | P00918 | 4/20 | 0.55 |
| ▸ | HTT | P42858 | 2/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.42 |
| ▸ | IMPDH2 | P12268 | 1/20 | 0.40 |
| ▸ | IMPDH1 | P20839 | 1/20 | 0.40 |
| ▸ | AR | P10275 | 1/20 | 0.39 |
| ▸ | DPP4 | P27487 | 2/20 | 0.37 |
| ▸ | ENPP2 | Q13822 | 1/20 | 0.37 |
| ▸ | ITK | Q08881 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29489120 | 1.00 | CA1 (0.55) | CA1CA2HTTKDM4EALDH1A1 | |
| Bicarbonate SCHEMBL11600417 | 0.91 | CA1 (0.51) | CA1CA2HTTKDM4EALDH1A1 | |
| SCHEMBL29489126 | 0.84 | CA1 (0.55) | CA1CA2HTTIMPDH2IMPDH1 | |
| SCHEMBL818900 | 0.84 | CA1 (0.55) | CA1CA2HTTIMPDH2IMPDH1 | |
| SCHEMBL18322219 | 0.81 | HTT (0.53) | CA1CA2HTTKDM4EALDH1A1 | |
| SCHEMBL13037655 | 0.80 | CA2 (0.57) | CA1CA2ALDH1A1IMPDH2IMPDH1 | |
| SCHEMBL1343465 | 0.79 | CA1 (0.69) | CA1CA2HTTKDM4EALDH1A1 | |
| Bicarbonate SCHEMBL11600387 | 0.79 | CA1 (0.46) | CA1CA2HTTKDM4EALDH1A1 | |
| SCHEMBL818940 | 0.79 | HTT (0.52) | CA1CA2HTTKDM4EALDH1A1 | |
| SCHEMBL25155668 | 0.78 | CA1 (0.47) | CA1CA2HTTKDM4EALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2382241-B1 | POLYMERS FUNCTIONALIZED WITH POLYCYANO COMPOUNDS | BRIDGESTONE CORP (JP) | 2016-11-23 | — | — | EP | claimed |
| US-8785566-B2 | Polymers functionalized with polycyano compounds | BRIDGESTONE CORPORATION (JP) | 2014-07-22 | — | — | US | claimed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-112236464-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-112204076-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-113646393-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-19 | — | — | CN | disclosed |
| CN-116490555-A | Copper-clad laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2023-07-25 | — | — | CN | disclosed |
| CN-115032863-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-113795522-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114867711-A | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-114787120-A | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-22 | — | — | CN | disclosed |
| US-20090137191-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090133716-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. | 2009-05-28 | — | — | US | disclosed |
| US-20090130849-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. | 2009-05-21 | — | — | US | disclosed |
| WO-2009058274-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058288-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058278-A1 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058275-A1 | METHODS OF POST CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING USING AMIDOXIME COMPOSITIONS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| WO-2009058272-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| US-20090107520-A1 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES | EKC TECHNOLOGY, INC. | 2009-04-30 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090137191-A1 | COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS | PADI2, PADI4, PADI3 | CA1 952/4885CA2 2808/4885HTT 3205/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.