SCHEMBL8202660

SCHEMBL8202660

CC(C)C1CCC(C)(c2ccc(Oc3ccccc3N)cc2)CC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.39
RCE1 Q9Y256 1/20 0.39
IKBKB O14920 2/20 0.38
BRAF P15056 1/20 0.38
ALDH1A1 P00352 3/20 0.38
LTA4H P09960 1/20 0.37
TLR4 O00206 1/20 0.36
LCK P06239 1/20 0.35
KDR P35968 1/20 0.35
TEK Q02763 1/20 0.35
TNK2 Q07912 1/20 0.33
SLC6A2 P23975 2/20 0.33
SLC6A4 P31645 2/20 0.33
SLC6A3 Q01959 2/20 0.33
NCOA1 Q15788 1/20 0.33
NCOA3 Q9Y6Q9 1/20 0.33
KDM4E B2RXH2 1/20 0.33
MAPT P10636 1/20 0.33
CRHBP P24387 1/20 0.33
CRHR2 Q13324 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8196759 0.81 GAA (0.35) GAARCE1IKBKBBRAFALDH1A1
SCHEMBL8202665 0.80 NCOA1 (0.44) GAAALDH1A1SLC6A2SLC6A4SLC6A3
SCHEMBL18016874 0.73 OPRL1 (0.39) ALDH1A1SLC6A2SLC6A4SLC6A3MAPK1
SCHEMBL8694525 0.71 ALDH1A1 (0.36) GAAALDH1A1MAPTTDP1MAPK1
SCHEMBL2285909 0.70 GAA (0.69) GAARCE1IKBKBBRAFALDH1A1
SCHEMBL8593394 0.70 ESR2 (0.40) OPRL1
SCHEMBL3095981 0.69 ALDH1A1 (0.50) GAARCE1IKBKBBRAFALDH1A1
SCHEMBL1270588 0.68 GAA (0.67) GAARCE1IKBKBBRAFALDH1A1
SCHEMBL1271606 0.68 GAA (0.67) GAARCE1IKBKBBRAFALDH1A1
SCHEMBL6289955 0.68 GAA (0.67) GAARCE1IKBKBBRAFALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6037438-A AS LAMINATES IN THE ELECTRIC AND ELECTRONIC FIELDS IN WHICH LOW-DIELECTRIC PROPERTY IS DESIRED AND ALSO APPLICABLE TO USES OF SEALING AND MOLDING SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-03-14 US disclosed
EP-0612783-B1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL CO (JP) 1999-05-06 EP disclosed
US-5750789-A FROM CORRESPONDING DIAMINE SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1998-05-12 US disclosed
EP-0612782-B1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL CO (JP) 1997-05-02 EP disclosed
US-5563237-A INCLUDES A BISMALEIMIDE HARDENER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-10-08 US disclosed
US-5498687-A Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-12 US disclosed
US-5444165-A Reacting diamino compound with unsaturated dicarboxylic anhydride to form amic acid intermediate, catalytic dehydration-ring closing; solvent soluble, low water absorption and flexibility SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-08-22 US disclosed
EP-0612782-A1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
EP-0612783-A1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
US-5326881-A Polymers with good heat resistance, good flexibility and low water absorption SUMITOMO CHEMICAL COMPANY LTD. (JP) 1994-07-05 US disclosed
EP-0595230-A1 Unsaturated imide compounds containing alicyclic structure SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-05-04 EP disclosed