SCHEMBL8202665

SCHEMBL8202665

CC(C)C1CCC(C)(c2ccccc2Oc2ccc(N)cc2)CC1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCOA1 Q15788 1/20 0.44
NCOA3 Q9Y6Q9 1/20 0.44
MAOA P21397 1/20 0.36
OPRL1 P41146 3/20 0.34
OPRM1 P35372 2/20 0.34
OPRK1 P41145 2/20 0.34
ALDH1A1 P00352 7/20 0.33
MAPT P10636 3/20 0.33
MAPK1 P28482 2/20 0.33
NPC1 O15118 2/20 0.33
RAB9A P51151 2/20 0.33
HPGD P15428 1/20 0.33
TDP1 Q9NUW8 2/20 0.33
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
KDM1A O60341 2/20 0.32
TEAD4 Q15561 1/20 0.32
HTT P42858 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
MEN1 O00255 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8468197 0.81 NCOA1 (0.47) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL8196762 0.80 NCOA1 (0.36) NCOA1NCOA3MAOAKDM1ASLC6A4
SCHEMBL8202660 0.80 GAA (0.39) NCOA1NCOA3OPRL1ALDH1A1MAPT
SCHEMBL8973157 0.78 ALDH1A1 (0.41) NCOA1NCOA3MAOAALDH1A1MAPT
SCHEMBL8632336 0.75 BRD4 (0.31) NCOA1NCOA3BRD4
SCHEMBL8694525 0.73 ALDH1A1 (0.36) ALDH1A1MAPTMAPK1NPC1RAB9A
SCHEMBL8196760 0.72 NCOA1 (0.39) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL5244034 0.71 HSD11B1 (0.41) OPRL1OPRM1OPRK1ALDH1A1
SCHEMBL8972892 0.69 MAOB (0.41) NCOA1NCOA3ALDH1A1MAPTMAPK1
SCHEMBL3095989 0.69 NCOA1 (0.46) NCOA1NCOA3MAOAALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6037438-A AS LAMINATES IN THE ELECTRIC AND ELECTRONIC FIELDS IN WHICH LOW-DIELECTRIC PROPERTY IS DESIRED AND ALSO APPLICABLE TO USES OF SEALING AND MOLDING SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-03-14 US disclosed
EP-0612783-B1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL CO (JP) 1999-05-06 EP disclosed
US-5750789-A FROM CORRESPONDING DIAMINE SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1998-05-12 US disclosed
EP-0612782-B1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL CO (JP) 1997-05-02 EP disclosed
US-5563237-A INCLUDES A BISMALEIMIDE HARDENER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-10-08 US disclosed
US-5498687-A Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-12 US disclosed
US-5444165-A Reacting diamino compound with unsaturated dicarboxylic anhydride to form amic acid intermediate, catalytic dehydration-ring closing; solvent soluble, low water absorption and flexibility SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-08-22 US disclosed
EP-0612782-A1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
EP-0612783-A1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
US-5326881-A Polymers with good heat resistance, good flexibility and low water absorption SUMITOMO CHEMICAL COMPANY LTD. (JP) 1994-07-05 US disclosed
EP-0595230-A1 Unsaturated imide compounds containing alicyclic structure SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-05-04 EP disclosed