SCHEMBL8196759

SCHEMBL8196759

CC(C)C1CCC(C)(c2ccc(Oc3ccccc3N)cc2)C(c2ccc(Oc3ccccc3N)cc2)C1

nearest known ligand 0.35

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.35
RCE1 Q9Y256 1/20 0.35
IKBKB O14920 1/20 0.34
BRAF P15056 1/20 0.34
SLC6A2 P23975 1/20 0.34
SLC6A4 P31645 1/20 0.34
SLC6A3 Q01959 1/20 0.34
ALDH1A1 P00352 1/20 0.33
LTA4H P09960 1/20 0.33
LCK P06239 1/20 0.32
KDR P35968 1/20 0.32
TEK Q02763 1/20 0.32
TNK2 Q07912 1/20 0.30
TLR4 O00206 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8973167 0.85 ALDH1A1 (0.35) GAAALDH1A1
SCHEMBL8703035 0.82 LTA4H (0.39) IKBKBSLC6A2SLC6A4ALDH1A1LTA4H
SCHEMBL8972571 0.81 MAOB (0.40) GAABRAFALDH1A1LTA4HTNK2
SCHEMBL8202660 0.81 GAA (0.39) GAARCE1IKBKBBRAFSLC6A2
SCHEMBL24322076 0.80 SLC6A4 (0.38) GAASLC6A2SLC6A4SLC6A3ALDH1A1
SCHEMBL8973404 0.77
SCHEMBL337274 0.76 KDM1A (0.40)
SCHEMBL8972653 0.76
SCHEMBL4333830 0.74 ESR2 (0.42)
SCHEMBL25987142 0.73 ALDH1A1 (0.34) GAASLC6A2SLC6A4SLC6A3ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6037438-A AS LAMINATES IN THE ELECTRIC AND ELECTRONIC FIELDS IN WHICH LOW-DIELECTRIC PROPERTY IS DESIRED AND ALSO APPLICABLE TO USES OF SEALING AND MOLDING SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-03-14 US disclosed
EP-0612783-B1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL CO (JP) 1999-05-06 EP disclosed
US-5750789-A FROM CORRESPONDING DIAMINE SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1998-05-12 US disclosed
EP-0612782-B1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL CO (JP) 1997-05-02 EP disclosed
US-5563237-A INCLUDES A BISMALEIMIDE HARDENER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-10-08 US disclosed
US-5498687-A Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-12 US disclosed
US-5444165-A Reacting diamino compound with unsaturated dicarboxylic anhydride to form amic acid intermediate, catalytic dehydration-ring closing; solvent soluble, low water absorption and flexibility SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-08-22 US disclosed
EP-0612782-A1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
EP-0612783-A1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
US-5326881-A Polymers with good heat resistance, good flexibility and low water absorption SUMITOMO CHEMICAL COMPANY LTD. (JP) 1994-07-05 US disclosed
EP-0595230-A1 Unsaturated imide compounds containing alicyclic structure SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-05-04 EP disclosed