SCHEMBL822069

SCHEMBL822069

CCC[CH][SiH](OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2125572 0.75
SCHEMBL821316 0.74 TSHR (0.30)
SCHEMBL3481788 0.72
SCHEMBL18492788 0.70 ALDH1A1 (0.33)
SCHEMBL14141715 0.65
SCHEMBL3482104 0.64 TSHR (0.35)
SCHEMBL17578912 0.59
SCHEMBL4446381 0.59
Propane SCHEMBL27533742 0.58
Butane SCHEMBL3984103 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113019868-A Method for producing coating material using electron beam-curable composition 东亚合成株式会社 2021-06-25 CN disclosed
EP-3132804-B1 MEDICAL DEVICE INCLUDING ANIONIC DRUG SEED CO LTD (JP) 2021-05-05 EP disclosed
EP-3816716-A1 ANIONIC DRUG-CONTAINING OPHTHALMIC DEVICE Seed Co., Ltd. (JP) 2021-05-05 EP disclosed
CN-112334819-A Ophthalmic device containing anionic agent 株式会社实瞳 2021-02-05 CN disclosed
US-10668157-B2 Anionic drug-containing medical device SEED CO., LTD. (JP) 2020-06-02 US disclosed
WO-2019151509-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION, AND USE THEREOF 東亞合成株式会社 2019-08-08 WO disclosed
EP-3132804-A1 MEDICAL DEVICE INCLUDING ANIONIC DRUG Seed Co., Ltd. (JP) 2017-02-22 EP disclosed
US-20170043017-A1 ANIONIC DRUG-CONTAINING MEDICAL DEVICE SEED CO., LTD. (JP) 2017-02-16 US disclosed
EP-1666536-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2014-03-12 EP disclosed
US-8652318-B2 Oleophobic surface coatings XEROX CORPORATION (US) 2014-02-18 US disclosed
US-20070213459-A1 Curable Composition KANEKA CORPORATION (JP) 2007-09-13 US disclosed
EP-1810995-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-07-25 EP disclosed
EP-1739133-A1 CURABLE COMPOSITIONS Kaneka Corporation (JP) 2007-01-03 EP disclosed
EP-1715002-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-10-25 EP disclosed
EP-1710279-A1 CURING COMPOSITION Kaneka Corporation (JP) 2006-10-11 EP disclosed
EP-1666536-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-06-07 EP disclosed
US-20060089431-A1 Curable composition KANEKA CORPORATION (JP) 2006-04-27 US disclosed
US-6734250-B2 IMPROVED ADHESION TO RESIN AND METAL SUBSTRATES, COMPRISING UNSATURATED POLYSILOXANE, SILICA, METAL POWDER, CURING AGENT AND ADHESION AID SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-05-11 US disclosed
EP-1233014-A1 ASYMMETRIC ORGANIC PEROXIDE, CROSSLINKING AGENT COMPRISING THE SAME, AND METHOD OF CROSSLINKING WITH THE SAME NOF CORPORATION (JP) 2002-08-21 EP disclosed
US-20020049274-A1 Electrically conductive silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-25 US disclosed