Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | ADORA1 | P30542 | 4/20 | 0.33 |
| ▸ | ADORA3 | P0DMS8 | 3/20 | 0.33 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.33 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | NCOA3 | Q9Y6Q9 | 1/20 | 0.31 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15204695 | 0.86 | ALDH1A1 (0.34) | L3MBTL1APOBEC3GALDH1A1MAPK1MAPT | |
| SCHEMBL3703117 | 0.79 | PDK2 (0.40) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL6855320 | 0.76 | ADORA1 (0.43) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL28831410 | 0.76 | ALDH1A1 (0.37) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL2849388 | 0.73 | TP53 (0.35) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL9271915 | 0.73 | TP53 (0.35) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL31531712 | 0.73 | ALDH1A1 (0.41) | ALDH1A1 | |
| SCHEMBL6334225 | 0.71 | ALDH1A1 (0.47) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| SCHEMBL6003149 | 0.71 | ADORA1 (0.39) | L3MBTL1TP53ADORA1ADORA3ADORA2A | |
| Hydrochloric Acid SCHEMBL11194272 | 0.69 | ADORA1 (0.38) | L3MBTL1TP53ADORA1ADORA3ADORA2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 317 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117363291-A | High-power conductive adhesive and preparation method and application thereof | 长春永固科技有限公司 | 2024-01-09 | — | — | CN | claimed |
| CN-116285823-A | Ceramic precursor-based high heat-resistant conductive silver adhesive and preparation method thereof | 中国电子科技集团公司第三十八研究所 | 2023-06-23 | — | — | CN | claimed |
| CN-113025230-B | Heat-conducting and electric-conducting copper paste, preparation method and application thereof | 中国电子科技集团公司第三十八研究所 | 2022-09-23 | — | — | CN | claimed |
| CN-114507494-A | High-temperature-resistant high-strength epoxy adhesive | 上海回天新材料有限公司 | 2022-05-17 | — | — | CN | claimed |
| CN-111518501-B | Preparation method of conductive silver adhesive with high thermal conductivity and conductive silver adhesive | 中国电子科技集团公司第三十八研究所 | 2022-04-15 | — | — | CN | claimed |
| CN-111584154-B | Preparation method of hole plugging silver paste for interconnection of any layers of multifunctional board and hole plugging silver paste | 中国电子科技集团公司第三十八研究所 | 2021-07-23 | — | — | CN | claimed |
| CN-113025230-A | Heat-conducting and electric-conducting copper paste, preparation method and application thereof | 中国电子科技集团公司第三十八研究所 | 2021-06-25 | — | — | CN | claimed |
| CN-112175562-A | Preparation method of epoxy silver conductive adhesive containing graphene/silver heat conduction network | 安徽工业大学 | 2021-01-05 | — | — | CN | claimed |
| CN-111584154-A | Preparation method of hole plugging silver paste for interconnection of any layers of multifunctional board and hole plugging silver paste | 中国电子科技集团公司第三十八研究所 | 2020-08-25 | — | — | CN | claimed |
| CN-111518501-A | Preparation method of novel conductive silver adhesive with high thermal conductivity and conductive silver adhesive | 中国电子科技集团公司第三十八研究所 | 2020-08-11 | — | — | CN | claimed |
| WO-2001083607-A1 | RHEOLOGY-CONTROLLED EPOXY-BASED COMPOSITIONS | HENKEL LOCTITE CORPORATION (US) | 2001-11-08 | — | — | WO | claimed |
| WO-2001074798-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2001-10-11 | — | — | WO | claimed |
| WO-2001072898-A1 | THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS | GEORGIA TECH RESEARCH CORPORATION (US) | 2001-10-04 | — | — | WO | claimed |
| WO-2000079582-A9 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORP (US) | 2001-03-15 | — | — | WO | claimed |
| WO-2000079582-A1 | CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2000-12-28 | — | — | WO | claimed |
| WO-1999035187-A1 | REWORKABLE EPOXY UNDERFILL ENCAPSULANTS | GEORGIA TECH RESEARCH CORPORATION (US) | 1999-07-15 | — | — | WO | claimed |
| EP-0502992-A4 | CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE | — | 1993-05-26 | — | — | EP | claimed |
| EP-0502992-A1 | CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE | ACHESON INDUSTRIES, INC. (US) | 1992-09-16 | — | — | EP | claimed |
| WO-1991004999-A1 | TWO-PACK CURABLE EPOXY RESIN COMPOSITION | COOKSON GROUP PLC (GB) | 1991-04-18 | — | — | WO | claimed |
| EP-0194895-A2 | 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-09-17 | — | — | EP | claimed |