Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.48 |
| ▸ | ESR1 | P03372 | 1/20 | 0.47 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 5/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.47 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.47 |
| ▸ | CA12 | O43570 | 1/20 | 0.46 |
| ▸ | CA1 | P00915 | 1/20 | 0.46 |
| ▸ | CA2 | P00918 | 1/20 | 0.46 |
| ▸ | CA9 | Q16790 | 1/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
| ▸ | GPR35 | Q9HC97 | 1/20 | 0.46 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1109007 | 0.84 | GABRA1 (0.54) | POLBESR1MAPTALDH1A1NPSR1 | |
| SCHEMBL10536423 | 0.83 | ALDH1A1 (0.54) | MAPTALDH1A1GAACA12CA1 | |
| SCHEMBL14478209 | 0.82 | MAPT (0.52) | POLBMAPTALDH1A1NPSR1CA12 | |
| SCHEMBL14478228 | 0.82 | MAPT (0.52) | POLBMAPTALDH1A1NPSR1CA12 | |
| SCHEMBL11620245 | 0.81 | ALDH1A1 (0.48) | POLBMAPTALDH1A1GAACA12 | |
| SCHEMBL13604867 | 0.79 | GRM4 (0.51) | POLBMAPTALDH1A1NPSR1CA12 | |
| SCHEMBL1026668 | 0.79 | ALDH1A1 (0.56) | MAPTALDH1A1GAACA12CA1 | |
| SCHEMBL7109573 | 0.77 | SNCA (0.47) | POLBESR1ESR2MAPTALDH1A1 | |
| SCHEMBL7531523 | 0.76 | MAPK1 (0.56) | MAPTALDH1A1GAANPSR1CA12 | |
| SCHEMBL1025776 | 0.76 | POLB (0.56) | POLBMAPTALDH1A1NPSR1CA12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1717851-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2012-10-17 | — | — | EP | disclosed |
| US-8142605-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-27 | — | — | US | disclosed |
| US-7967943-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-06-28 | — | — | US | disclosed |
| US-20110114893-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| US-7879956-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-7700007-B2 | Anisotropic conductive film forming composition | CHEIL INDUSTRIES, INC. (KR) | 2010-04-20 | — | — | US | disclosed |
| US-7629050-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-7629056-B2 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-7618713-B2 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-11-17 | — | — | US | disclosed |
| US-7604868-B2 | Interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; superior low temperature rapid curability and a long pot life | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-10-20 | — | — | US | disclosed |
| EP-1717851-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2006-11-02 | — | — | EP | disclosed |
| US-20060148956-A1 | Anisotropic conductive film forming composition | KUKDO CHEMICAL CO., LTD. (KR) | 2006-07-06 | — | — | US | disclosed |
| US-20060060969-A1 | Electronic circuit including circuit-connecting material | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060063366-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060014860-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| EP-1542273-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |