Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 15/20 | 0.45 |
| ▸ | ESR2 | Q92731 | 9/20 | 0.45 |
| ▸ | AR | P10275 | 3/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.32 |
| ▸ | XBP1 | P17861 | 1/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | CNR1 | P21554 | 1/20 | 0.31 |
| ▸ | CNR2 | P34972 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29577693 | 1.00 | ESR1 (0.45) | ESR1ESR2ARTDP1TP53 | |
| SCHEMBL12606670 | 0.84 | ESR1 (0.58) | ESR1ESR2ARTDP1TP53 | |
| SCHEMBL12606730 | 0.81 | ESR1 (0.54) | ESR1ESR2ARTDP1TP53 | |
| SCHEMBL12606671 | 0.81 | ESR1 (0.54) | ESR1ESR2ARTDP1TP53 | |
| SCHEMBL836820 | 0.80 | ACHE (0.41) | ESR1ESR2CNR1CNR2 | |
| SCHEMBL9572377 | 0.79 | RORC (0.52) | — | |
| SCHEMBL9803635 | 0.78 | ESR1 (0.54) | ESR1ESR2ARTDP1TP53 | |
| SCHEMBL9615429 | 0.78 | GABRA1 (0.40) | ESR1ESR2MEN1LMNAMAPT | |
| SCHEMBL2855402 | 0.78 | ESR2 (0.38) | ESR1ESR2ARLMNA | |
| SCHEMBL19842173 | 0.77 | ESR1 (0.39) | ESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11767452-B2 | Curable composition, especially as crystallizing rubber to substrate bonding primer | HENKEL AG & CO. KGAA (DE) | 2023-09-26 | — | — | US | disclosed |
| EP-3369770-B1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | HENKEL AG & CO KGAA (DE) | 2021-12-22 | — | — | EP | disclosed |
| EP-3135740-B1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO KGAA (DE) | 2018-10-10 | — | — | EP | disclosed |
| WO-2018158128-A1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | HENKEL AG & CO. KGAA (DE) | 2018-09-07 | — | — | WO | disclosed |
| EP-3369770-A1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | Henkel AG & Co. KGaA (DE) | 2018-09-05 | — | — | EP | disclosed |
| US-20180163101-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2018-06-14 | — | — | US | disclosed |
| WO-2017037074-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2017-03-09 | — | — | WO | disclosed |
| EP-3135740-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | Henkel AG & Co. KGaA (DE) | 2017-03-01 | — | — | EP | disclosed |
| EP-1542273-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-1717851-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2012-10-17 | — | — | EP | disclosed |
| EP-1350140-A2 | POSITIVE TYPE PHOTOSENSITIVE EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | Vantico AG (CH) | 2003-10-08 | — | — | EP | disclosed |
| EP-0896975-B1 | POLYCARBONATE, AND MOLDING AND ELECTROPHOTOGRAPHIC PHOTORECEPTOR PREPARED THEREFROM | IDEMITSU KOSAN CO (JP) | 2003-06-04 | — | — | EP | disclosed |
| EP-1288242-A2 | Polycarbonate, and molding and electrophotograpic photoreceptor prepared therefrom | Idemitsu Kosan Co., Ltd. (JP) | 2003-03-05 | — | — | EP | disclosed |
| WO-2002041079-A2 | POSITIVE TYPE PHOTOSENSITIVE EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | VANTICO AG (CH) | 2002-05-23 | — | — | WO | disclosed |
| EP-1178068-A1 | PROCESSES FOR PRODUCING RAW POLYCARBONATE RESIN MATERIAL AND PRODUCING POLYCARBONATE RESIN | IDEMITSU PETROCHEMICAL CO., LTD. (JP) | 2002-02-06 | — | — | EP | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| US-6136521-A | POLYORGANOSILOXANE-CONTAINING POLYCARBONATE | IDEMITSU KOSAN CO., LTD. (JP) | 2000-10-24 | — | — | US | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
| EP-0896975-A1 | POLYCARBONATE, AND MOLDING AND ELECTROPHOTOGRAPHIC PHOTORECEPTOR PREPARED THEREFROM | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1999-02-17 | — | — | EP | disclosed |
| EP-0837085-A1 | POLYCARBONATE-BASE POLYMER, PRODUCTION PROCESS, RESIN COATING FLUID PREPARED THEREFROM, AND ELECTROPHOTOGRAPHIC PHOTORECEPTOR PREPARED THEREFROM | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1998-04-22 | — | — | EP | disclosed |