Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NUDT1 | P36639 | 1/20 | 0.38 |
| ▸ | BACE1 | P56817 | 1/20 | 0.38 |
| ▸ | CNR1 | P21554 | 7/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | CNR2 | P34972 | 6/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.33 |
| ▸ | PTGDR2 | Q9Y5Y4 | 1/20 | 0.32 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.32 |
| ▸ | THRA | P10827 | 1/20 | 0.31 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27411644 | 0.84 | NUDT1 (0.39) | NUDT1BACE1CNR1HSP90AA1CNR2 | |
| SCHEMBL30104451 | 0.84 | NUDT1 (0.39) | NUDT1BACE1CNR1HSP90AA1CNR2 | |
| SCHEMBL9853953 | 0.81 | CNR1 (0.39) | NUDT1BACE1CNR1HSP90AA1CNR2 | |
| SCHEMBL30320264 | 0.79 | ESR1 (0.39) | NUDT1BACE1CNR1HSP90AA1CYP2D6 | |
| SCHEMBL29623065 | 0.79 | ESR1 (0.39) | NUDT1BACE1CNR1HSP90AA1CYP2D6 | |
| SCHEMBL278477 | 0.79 | ESR1 (0.39) | NUDT1BACE1CNR1HSP90AA1CYP2D6 | |
| SCHEMBL1245161 | 0.77 | NUDT1 (0.45) | NUDT1BACE1CNR1HSP90AA1CNR2 | |
| SCHEMBL23155351 | 0.76 | ESR1 (0.44) | NUDT1BACE1CNR1HSP90AA1CYP2D6 | |
| SCHEMBL278349 | 0.76 | ESR1 (0.37) | NUDT1BACE1CNR1HSP90AA1CNR2 | |
| SCHEMBL8656679 | 0.76 | ESR1 (0.38) | NUDT1BACE1CNR1HSP90AA1CNR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3369770-B1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | HENKEL AG & CO KGAA (DE) | 2021-12-22 | — | — | EP | disclosed |
| CN-110431177-A | Curable composition, in particular as primer for the adhesion of crystalline rubbers to substrates | HENKEL AG & CO KGAA | 2019-11-08 | — | — | CN | disclosed |
| EP-3135740-B1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO KGAA (DE) | 2018-10-10 | — | — | EP | disclosed |
| WO-2018158128-A1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | HENKEL AG & CO. KGAA (DE) | 2018-09-07 | — | — | WO | disclosed |
| EP-3369770-A1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | Henkel AG & Co. KGaA (DE) | 2018-09-05 | — | — | EP | disclosed |
| US-20180163101-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2018-06-14 | — | — | US | disclosed |
| WO-2017037074-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2017-03-09 | — | — | WO | disclosed |
| EP-3135740-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | Henkel AG & Co. KGaA (DE) | 2017-03-01 | — | — | EP | disclosed |
| EP-1542273-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-1717851-B1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO LTD (JP) | 2012-10-17 | — | — | EP | disclosed |
| EP-1717851-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2006-11-02 | — | — | EP | disclosed |
| EP-1688965-A2 | Heatcurable dielectric resin composition and heatcurable dielectric resin film | Nippon Paint Co., Ltd. (JP) | 2006-08-09 | — | — | EP | disclosed |
| US-20060148956-A1 | Anisotropic conductive film forming composition | KUKDO CHEMICAL CO., LTD. (KR) | 2006-07-06 | — | — | US | disclosed |
| US-20060060969-A1 | Electronic circuit including circuit-connecting material | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060063366-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060014860-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| EP-1542273-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | Hitachi Chemical Co., Ltd. (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |