SCHEMBL838422

SCHEMBL838422

CCCCO[Si](C)(OC)OC

nearest known ligand 0.38

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 1/20 0.38
ADRB1 P08588 1/20 0.38
ADRB3 P13945 1/20 0.38
TSHR P16473 2/20 0.33
CYP3A4 P08684 1/20 0.33
CYP19A1 P11511 2/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2D6 P10635 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
ALDH1A1 P00352 1/20 0.32
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
LMNA P02545 1/20 0.30
ATM Q13315 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8083875 0.95 ADRB2 (0.38) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL6295813 0.92 DNM1 (0.35) TSHRALDH1A1CA1CA2LMNA
SCHEMBL31233501 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL28994540 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL27950184 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL25277699 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL28994654 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL31506910 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL28846726 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2
SCHEMBL28404018 0.90 DNM1 (0.39) TSHRALDH1A1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023171323-A1 TIRE 住友ゴム工業株式会社 2023-09-14 WO disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed
CN-107709464-B Silicon-containing resin composition 东京应化工业株式会社 2021-09-28 CN disclosed
WO-2021065390-A1 JOINED BODY AND PRIMER-EQUIPPED MATERIAL 昭和電工株式会社 2021-04-08 WO disclosed
WO-2021029227-A1 COMPOSITE LAYERED PRODUCT AND METAL/MODIFIED-POLY(PHENYLENE ETHER) BONDED OBJECT 昭和電工株式会社 2021-02-18 WO disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
CN-107922733-B Polyimide precursor composition 东京应化工业株式会社 2020-09-11 CN disclosed
EP-3455659-A1 CAST LENS Vision Ease LP (US) 2019-03-20 EP disclosed
CN-106366999-A Liquid crystal sealing agent and liquid crystal display cell using the same 日本化药株式会社 2017-02-01 CN disclosed
CN-105462527-A Preparing method for novel environment-friendly adhesive WUXI JIJIN ENV PROT TECH CO LTD 2016-04-06 CN disclosed
US-20100279091-A1 REFLECTIVE FILM MITSUBISHI PLASTICS, INC. (JP) 2010-11-04 US disclosed
EP-2220156-A1 HYDROPHOBIC MODIFICATION OF MINERAL FILLERS AND MIXED POLYMER SYSTEMS Pacific Polymers Pty Ltd (AU) 2010-08-25 EP disclosed
WO-2009059382-A1 HYDROPHOBIC MODIFICATION OF MINERAL FILLERS AND MIXED POLYMER SYSTEMS PACIFIC POLYMERS PTY LTD (AU) 2009-05-14 WO disclosed
US-20080286474-A1 Hydrophobing Minerals and Filler Materials DOW SILICONES CORPORATION 2008-11-20 US disclosed
EP-1964669-A1 REFLECTIVE FILM MITSUBISHI PLASTICS INC. (JP) 2008-09-03 EP disclosed
EP-1904415-A2 HYDROPHOBING MINERALS AND FILLER MATERIALS Dow Corning Corporation (US) 2008-04-02 EP disclosed
WO-2007009935-A2 HYDROPHOBING MINERALS AND FILLER MATERIALS DOW CORNING CORPORATION (US) 2007-01-25 WO disclosed
EP-0691362-B1 Method of producing organopolysiloxanes containing hydrolyzable functional groups, and curable resin composition using said organopolysiloxanes SHINETSU CHEMICAL CO (JP) 2000-10-25 EP disclosed
US-5633311-A ROOM TEMPERATURE CURABLE RESIN SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-05-27 US disclosed
EP-0691362-A2 Method of producing organopolysiloxanes containing hydrolyzable functional groups, and curable resin composition using said organopolysiloxanes Shin-Etsu Chemical Co., Ltd. (JP) 1996-01-10 EP disclosed