SCHEMBL84235

SCHEMBL84235

O=C1NC(=O)c2c(OS(=O)(=O)c3c(F)c(F)c(F)c(F)c3F)ccc3cccc1c23

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 3/20 0.45
MEN1 O00255 4/20 0.36
KMT2A Q03164 4/20 0.36
PKM P14618 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
NPSR1 Q6W5P4 2/20 0.35
PARG Q86W56 1/20 0.33
ALDH1A1 P00352 4/20 0.32
CES2 O00748 1/20 0.32
BCHE P06276 1/20 0.32
CES1 P23141 1/20 0.32
MCL1 Q07820 1/20 0.32
MAPT P10636 3/20 0.31
CASP7 P55210 2/20 0.31
RGS12 O14924 1/20 0.31
USP2 O75604 1/20 0.31
CYP1A2 P05177 1/20 0.31
POLB P06746 1/20 0.31
CYP3A4 P08684 1/20 0.31
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5668275 0.82 PARP1 (0.47) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL2041353 0.81 PARP1 (0.51) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL1516405 0.80 PARP1 (0.47) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL28590452 0.80 PARP1 (0.50) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL7046262 0.80 ALDH1A1 (0.48) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL1419748 0.75 PARP1 (0.42) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL28678417 0.74 PARP1 (0.58) PARP1MEN1KMT2ASMN1; SMN2NPSR1
SCHEMBL29089233 0.74 PARP1 (0.66) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL17726920 0.73 PARP1 (0.61) PARP1MEN1KMT2APKMSMN1; SMN2
SCHEMBL84234 0.72 MAPT (0.33) MEN1KMT2ANPSR1ALDH1A1CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1938149-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS International Business Machines Corporation (US) 2008-07-02 EP claimed
WO-2007039346-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-04-12 WO claimed
WO-2019171188-A1 PHOTOACTIVE POLYMER BRUSH MATERIALS AND EUV PATTERNING USING THE SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2019-09-12 WO disclosed
CN-109782540-A The forming method of photoetching agent pattern 台湾积体电路制造股份有限公司 2019-05-21 CN disclosed
EP-2742385-A2 DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS International Business Machines Corporation (US) 2014-06-18 EP disclosed
WO-2014078789-A1 METHODS FOR FORMING NANOPARTICLES USING SEMICONDUCTOR MANUFACTURING INFRASTRUCTURE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-05-22 WO disclosed
WO-2013190406-A1 ORGANIC SOLVENT DEVELOPABLE PHOTORESIST COMPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-12-27 WO disclosed
WO-2013023124-A2 DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-02-14 WO disclosed
US-8128832-B2 Processes and materials for step and flash imprint lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-03-06 US disclosed
WO-2011101259-A2 SULFONAMIDE-CONTAINING TOPCOAT AND PHOTORESIST ADDITIVE COMPOSITIONS AND METHODS OF USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-08-25 WO disclosed
WO-2011101260-A2 SULFONAMIDE-CONTAINING PHOTORESIST COMPOSITIONS AND METHODS OF USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-08-25 WO disclosed
WO-2010114716-A1 USING ELECTRIC-FIELD DIRECTED POST-EXPOSURE BAKE FOR DOUBLE PATTERNING (D-P) TOKYO ELECTRON LIMITED (JP) 2010-10-07 WO disclosed
WO-2010094531-A1 ULTRA LOW POST EXPOSURE BAKE PHOTORESIST MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-08-26 WO disclosed
EP-1996144-A2 COMPOSITE MATERIAL, IN PARTICULAR A DENTAL FILLING MATERIAL Dentofit A/S (DK) 2008-12-03 EP disclosed
US-7419611-B2 Processes and materials for step and flash imprint lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-09-02 US disclosed
US-20080169268-A1 PROCESSES AND MATERIALS FOR STEP AND FLASH IMPRINT LITHOGRAPHY GLOBALFOUNDRIES INC. (KY) 2008-07-17 US disclosed
EP-1938149-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS International Business Machines Corporation (US) 2008-07-02 EP disclosed
WO-2007104312-A2 COMPOSITE MATERIAL, IN PARTICULAR A DENTAL FILLING MATERIAL DENTOFIT A/S (DK) 2007-09-20 WO disclosed
WO-2007039346-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-04-12 WO disclosed
US-20070051697-A1 Processes and materials for step and flash imprint lithography GLOBALFOUNDRIES INC. (KY) 2007-03-08 US disclosed