SCHEMBL84234

SCHEMBL84234

O=C1NC(=O)c2c1c(OS(=O)(=O)c1c(F)c(F)c(F)c(F)c1F)cc1ccccc21

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.33
ALDH1A1 P00352 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
CDK4 P11802 5/20 0.32
CCND1 P24385 5/20 0.32
CCNE2 O96020 3/20 0.32
CCNE1 P24864 3/20 0.32
CDK2 P24941 3/20 0.32
CAMK2B Q13554 2/20 0.32
CAMK2G Q13555 2/20 0.32
CAMK2D Q13557 2/20 0.32
CAMK2A Q9UQM7 2/20 0.32
CES1 P23141 2/20 0.32
CHEK1 O14757 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CASP3 P42574 1/20 0.32
TUBB4A P04350 1/20 0.31
TUBB P07437 1/20 0.31
TUBA3C P0DPH7 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1029435 0.80 ALDH1A1 (0.42) MAPTALDH1A1NPSR1CDK4CCND1
SCHEMBL1516404 0.79 ADORA2A (0.35) MAPTALDH1A1NPSR1CDK4CCND1
SCHEMBL7046260 0.79 KMT2A (0.46) MAPTALDH1A1TUBB4ATUBBTUBA3C
SCHEMBL15543485 0.74 CA1 (0.35) MAPTALDH1A1NPSR1CDK4CCND1
SCHEMBL16415844 0.73 CA1 (0.36) MAPTALDH1A1NPSR1CDK4CCND1
SCHEMBL84235 0.72 PARP1 (0.45) MAPTALDH1A1NPSR1CES1CASP3
SCHEMBL11667133 0.70 CES1 (0.39) MAPTALDH1A1CDK4CCND1CCNE2
SCHEMBL13813789 0.69 CA12 (0.47) ALDH1A1NPSR1CA1MEN1KMT2A
SCHEMBL7430843 0.69 GPR84 (0.41) MAPTALDH1A1NPSR1CDK4CCND1
SCHEMBL5764686 0.68 ALDH1A1 (0.35) ALDH1A1NPSR1CDK4CCND1CCNE2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1938149-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS International Business Machines Corporation (US) 2008-07-02 EP claimed
WO-2007039346-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-04-12 WO claimed
WO-2019171188-A1 PHOTOACTIVE POLYMER BRUSH MATERIALS AND EUV PATTERNING USING THE SAME INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2019-09-12 WO disclosed
EP-2742385-A2 DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS International Business Machines Corporation (US) 2014-06-18 EP disclosed
WO-2014078789-A1 METHODS FOR FORMING NANOPARTICLES USING SEMICONDUCTOR MANUFACTURING INFRASTRUCTURE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-05-22 WO disclosed
WO-2013190406-A1 ORGANIC SOLVENT DEVELOPABLE PHOTORESIST COMPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-12-27 WO disclosed
WO-2013023124-A2 DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS FOR NEGATIVE RESISTS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-02-14 WO disclosed
US-8128832-B2 Processes and materials for step and flash imprint lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-03-06 US disclosed
WO-2011101259-A2 SULFONAMIDE-CONTAINING TOPCOAT AND PHOTORESIST ADDITIVE COMPOSITIONS AND METHODS OF USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-08-25 WO disclosed
WO-2011101260-A2 SULFONAMIDE-CONTAINING PHOTORESIST COMPOSITIONS AND METHODS OF USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-08-25 WO disclosed
WO-2011054572-A1 SILICON CONTAINING COATING COMPOSITIONS AND METHODS OF USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-05-12 WO disclosed
WO-2010114716-A1 USING ELECTRIC-FIELD DIRECTED POST-EXPOSURE BAKE FOR DOUBLE PATTERNING (D-P) TOKYO ELECTRON LIMITED (JP) 2010-10-07 WO disclosed
WO-2010094531-A1 ULTRA LOW POST EXPOSURE BAKE PHOTORESIST MATERIALS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-08-26 WO disclosed
EP-1996144-A2 COMPOSITE MATERIAL, IN PARTICULAR A DENTAL FILLING MATERIAL Dentofit A/S (DK) 2008-12-03 EP disclosed
US-7419611-B2 Processes and materials for step and flash imprint lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-09-02 US disclosed
US-20080169268-A1 PROCESSES AND MATERIALS FOR STEP AND FLASH IMPRINT LITHOGRAPHY GLOBALFOUNDRIES INC. (KY) 2008-07-17 US disclosed
EP-1938149-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS International Business Machines Corporation (US) 2008-07-02 EP disclosed
WO-2007104312-A2 COMPOSITE MATERIAL, IN PARTICULAR A DENTAL FILLING MATERIAL DENTOFIT A/S (DK) 2007-09-20 WO disclosed
WO-2007039346-A2 LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENTS FOR PHOTORESIST APPLICATIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-04-12 WO disclosed
US-20070051697-A1 Processes and materials for step and flash imprint lithography GLOBALFOUNDRIES INC. (KY) 2007-03-08 US disclosed