Ethylenediamine

Ethylenediamine

SCHEMBL8467918

Cc1ccc(OP(=O)(O)Oc2ccc(C)cc2)cc1.NCCN

nearest known ligand 0.57

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D

The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.55
CYP3A4 P08684 1/20 0.55
CES2 O00748 1/20 0.46
CES1 P23141 1/20 0.46
LMNA P02545 3/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
MAPT P10636 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
BLM P54132 1/20 0.41
CYP2C19 P33261 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
NPC1 O15118 1/20 0.40
ALDH1A1 P00352 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL157866 0.90 TSHR (0.67) TSHRCYP3A4CES2CES1LMNA
Fluoride SCHEMBL31047203 0.88 TSHR (0.64) TSHRCYP3A4CES2CES1LMNA
SCHEMBL1983846 0.88 TSHR (0.64) TSHRCYP3A4CES2CES1LMNA
SCHEMBL8884790 0.88 TSHR (0.64) TSHRCYP3A4CES2CES1LMNA
SCHEMBL218003 0.82 CYP3A4 (0.57) TSHRCYP3A4CES2CES1LMNA
Toluene SCHEMBL28459052 0.82 TSHR (0.57) TSHRCYP3A4CES2CES1LMNA
SCHEMBL28149403 0.81 CYP2C19 (0.64) TSHRCYP3A4CES2CES1LMNA
Naphthalene SCHEMBL15952534 0.81 CYP3A4 (0.55) TSHRCYP3A4CES2CES1LMNA
SCHEMBL5597386 0.81 TSHR (0.55) TSHRCYP3A4CES2CES1LMNA
SCHEMBL19277192 0.80 CYP3A4 (0.50) TSHRCYP3A4LMNAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4215568-B1 COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT DAIKIN IND LTD (JP) 2025-11-26 EP disclosed
WO-2024135735-A1 FOAM MOLDING COMPOSITION, FOAM-MOLDED BODY, FOAMED ELECTRIC WIRE, MANUFACTURING METHOD FOR FOAM-MOLDED BODY, MANUFACTURING METHOD FOR ELECTRIC WIRE, AND IN-VEHICLE NETWORK CABLE ダイキン工業株式会社 2024-06-27 WO disclosed
US-20230242771-A1 COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT DAIKIN INDUSTRIES, LTD. (JP) 2023-08-03 US disclosed
US-20230235182-A1 POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE DAIKIN INDUSTRIES, LTD. (JP) 2023-07-27 US disclosed
EP-4215568-A1 COMPOSITION FOR THREE-DIMENSIONAL SHAPING AND THREE-DIMENSIONAL SHAPED OBJECT Daikin Industries, Ltd. (JP) 2023-07-26 EP disclosed
EP-4215593-A1 POWDER COMPOSITION, COATING FILM, AND THREE-DIMENSIONAL SHAPED ARTICLE Daikin Industries, Ltd. (JP) 2023-07-26 EP disclosed
WO-2022030293-A1 FOAM MOLDING COMPOSITION, FOAMED MOLDED BODY, ELECTRIC WIRE, METHOD FOR MANUFACTURING FOAMED MOLDED BODY, AND METHOD FOR MANUFACTURING ELECTRIC WIRE ダイキン工業株式会社 2022-02-10 WO disclosed
WO-2022030500-A1 FOAM MOLDING COMPOSITION, FOAMED MOLDED BODY, ELECTRIC WIRE, METHOD FOR MANUFACTURING FOAMED MOLDED BODY, AND METHOD FOR MANUFACTURING ELECTRIC WIRE ダイキン工業株式会社 2022-02-10 WO disclosed
US-5936048-A Method for preparing modified resins and their applications MITSUI CHEMICALS, INC. (JP) 1999-08-10 US disclosed
US-5869184-A RESIN RAW MATERIALS FOR PAINTS, ADHESIVES MITSUI TOATSU CHEMICALS, INC. (JP) 1999-02-09 US disclosed
US-5674947-A HEATING RESIN WITH FUNCTIONALIZED NORBORNENE COMPOUND IN ABSENCE OF REACTION CATALYST OR INITIATOR MITSUI TOATSU CHEMICALS, INC. (JP) 1997-10-07 US disclosed
US-5648446-A ADHESIVES, FIREPROOFING, HEAT RESISTANCE IN RESINS FOR MOLDING MATERIALS MITSUI TOATSU CHEMICALS, INC. (JP) 1997-07-15 US disclosed
US-5646240-A THERMOSETTING MOLDING COMPOSITIONS MITSUI TOATSU CHEMICALS, INC. (JP) 1997-07-08 US disclosed
US-5596039-A FLAME RETARDERS, HEAT RESISTANCE MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1997-01-21 US disclosed
US-5569726-A USEFUL IN FLAME-RETARDING, THERMAL STABILIZATION AND COMPATIBILIZATION OF RESINS AND IN THERMOSETTING MOLDING COMPOSITIONS MITSUI TOATSU CHEMICALS, INC. (JP) 1996-10-29 US disclosed
US-5545702-A THERMOSETTING RESIN COMPOSITION MITSUI TOATSU CHEMICALS, INC. (JP) 1996-08-13 US disclosed
US-5536795-A ADHESIVES AND PAINTS AND FIREPROOFING THERMOSETTING RESINS MITSUI TOATSU CHEMICALS, INC. (JP) 1996-07-16 US disclosed
EP-0698620-A1 Method for preparing modified resins and their applications MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-02-28 EP disclosed
US-5480947-A N-METHYLOL DIGUANAMINES MITSUI TOATSU CHEMICALS, INC. (JP) 1996-01-02 US disclosed
EP-0612797-A2 Modification method of resins MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-08-31 EP disclosed